Lamination type three-dimensional LTCC perpendicular-interconnection microwave module

Abstract

The invention discloses a lamination type three-dimensional LTCC perpendicular-interconnection microwave module. The lamination type three-dimensional microwave module comprises a metal supporting body, a dielectric body, an upper layer LTCC substrate and a lower layer LTCC substrate, wherein the upper layer LTCC substrate and the lower layer LTCC substrate are designed according to work frequency bands of a microwave circuit module. A fuzz button perpendicular-interconnection structure is embedded in the dielectric body in the vertical direction. The upper layer LTCC substrate and the lower layer LTCC substrate are aligned and laminated on the upper surface and the lower surface of the dielectric body respectively. The upper layer LTCC substrate and the lower layer LTCC substrate are perpendicularly interconnected in a microwave mode through fuzz buttons in the dielectric body. The dielectric body and the LTCC substrates are arranged in the metal supporting body after being aligned and laminated, so that the lamination type three-dimensional LTCC perpendicular-interconnection microwave module is obtained. The microwave module is easy to locate and dismantle and low in cost of the perpendicular-interconnection technology, high-reliability electrical interconnection between the two-dimensional LTCC microwave substrates is achieved through the three-wire type fuzz buttons, and good microwave perpendicular transmission performance is achieved in the X waveband lamination type three-dimensional microwave circuit module.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and in particular relates to a solderless vertical interconnection technology between three-dimensional LTCC modules. Background technique [0002] With the increasing demand for miniaturization, high integration, low cost and high reliability of electronic equipment such as mobile communications, microwave circuits have also evolved from traditional microwave monolithic integrated circuits (MMICs), microwave multi-chip modules (MCMs), and To microwave two-dimensional multi-chip module (2D-MCM), and now to microwave three-dimensional multi-chip module (3D-MCM). The three-dimensional microwave multi-chip module technology is to mount MMIC chips and chip components on the LTCC multi-layer ceramic substrate to form a two-dimensional multi-chip microwave module, and then vertically interconnect multiple two-dimensional multi-chip modules to form a three-dimensional multi-chip Microwave circ...

AI Technical Summary

Problems solved by technology

Ball grid array soldering uses solder balls on the upper and lower sides of the substrate for vertical interconnection, but the reliability of this vertical interconnection process is low, and it is easy to cause defects such as solder accumulation or voids, which in turn affects the performance of the microwave module

As a connecting device, the elastic connector of fur button realizes solderless connection, and has good microwave and DC connection performance. Some scholars in the United States, Japan and China have made some achievements in the microwave low frequency band, but the application in the microwave high frequency band needs to be further improved.

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