The utility model discloses a fine needle group module for
microwave circuit
chip substrate
punching processing belongs to
chip substrate
punching technical field, and this group module includes removal
assembly, punch
assembly, storage box and drain
pipe, and the cleaning
assembly is through the cleaning board of torsional spring connection, can be in the automatic contact of hollow type
punching fine needle upward reset, removes the substrate debris of fine needle surface attachment, avoids the
chip with fine needle secondary and takes into the hole or pollutes other area, and the cleaning assembly is through the storage of
storage tank deionized water, after punching is completed, and starts
solenoid valve can utilize external air pressure, makes deionized water through drain
pipe accurate injection in the hole, removes the residual debris and
processing impurity in the hole, compared with traditional manual cleaning or corrosive solution cleaning, and deionized water will not corrode fine needle, also will not destroy
microwave substrate
material quality, guarantees the cleaning effect simultaneously, protects the performance and fine needle life of substrate, reduces the
rework rate of follow -up.