14 results about "Microwave substrate" patented technology

The invention discloses a microwave substrate defect identification and automatic sorting method, which comprises the following steps of: setting a first machine position to carry out front and back judgment on a microwave substrate, and entering a second machine position when judging that the microwave substrate is the front side; setting a second machine position for front detection and positioning, identifying front defects, and determining to enter a third machine position or move into a waste tank according to an identification result; a third machine position is arranged for reverse side detection and template matching; determining to enter a fourth machine position or move into a waste tank according to a detection result; a fourth machine position is arranged to execute microwave substrate placement and neat sleeving performance detection; determining whether sorting is completed or not according to a detection result; iDs are generated for each microwave substrate, data recording, query and tracing are carried out, and the whole-process processing quality of the microwave substrates is guaranteed. According to the invention, the whole-process treatment of the microwave substrate is realized, the product quality consistency and the production efficiency are improved, and higher economic benefits and quality management guarantee are brought to enterprises.

This invention discloses a method for preparing a low-loss ultrathin PTFE microwave dielectric substrate. The method includes the following steps: 1. Preparation of PTFE composite adhesive; 2. Impregnation with glass fiber cloth; 3. Lamination of sheet substrates. The PTFE microwave dielectric substrate prepared by this method has fine filler particles and a high filling rate, improving the uniformity of the ultrathin substrate thickness and dielectric constant. The substrate thickness is 0.065mm ± 0.008mm, and the dielectric constant at 10GHz is 2.95 ± 0.03. It also reduces the loss factor at high frequencies, with a loss factor ≤ 0.0011 at 10GHz. The preparation process is simple, easy to scale up for continuous production, and the microwave substrate exhibits excellent performance, meeting the stringent performance requirements of multilayer circuit boards in high-frequency communication applications.

The application discloses a self-embedded extendable antenna array, which is composed of an antenna unit, a multifunctional column, a mounting back plate, a connector, a self-embedded film and a fastening screw. The antenna printed board is composed of two layers of microwave substrates and one layer of a semi-cured sheet, one exponential metal patch and one feather-shaped metal patch, one feather-shaped metal patch, one exponential metal patch and one feather-shaped metal patch are respectively arranged on three surfaces of the microwave substrates, and a sandwich structure is formed. When the antenna printed board is mounted, 0.2mm-thick self-embedded films are pasted on both sides of the antenna printed board, the antenna printed board, the self-embedded film and the multifunctional column are in interference fit, so that self-embedded assembly is realized. The antenna unit and the multifunctional column are both modular units, so the size of the antenna array can be expanded by changing the size of the mounting back plate, meanwhile, the overall thickness of the antenna array is 18.5mm, the working bandwidth covers 9 times of frequency, and the antenna array has the characteristics of low profile and light weight.

The invention discloses a superconducting filtering coupling amplification assembly applied to a deep space exploration receiver system. The superconducting filtering coupling amplification assembly comprises a box body; the box body is divided into a first cavity and a second cavity which are mutually independent through a partition plate; a superconducting filtering coupling circuit is mounted in the first cavity; a low-temperature low-noise amplifier circuit is mounted in the second cavity; the signal output end of the superconducting filtering coupling circuit is connected with the signal input end of the low-temperature low-noise amplifier circuit through a bridging gold wire; the superconducting filter coupling circuit comprises a superconducting filter and a superconducting coupler which are integrated on the same dielectric substrate; the low-temperature low-noise amplifier circuit comprises a low-temperature low-noise amplifier chip and an amplifier biasing circuit which are integrated on the same microwave substrate. According to the invention, high-frequency-selection suppression filtering and low-noise receiving amplification of received signals can be realized, a calibration signal injection function is realized, and the amplifier is suitable for various microwave circuits, and is especially suitable for application scenes with extreme noise control requirements, such as a deep space exploration receiver and the like.

The application discloses a kind of ultra-low dielectric low-temperature silicate lithium aluminum microwave dielectric ceramic materials and preparation method and application, belong to ceramic material technical field.The ultra-low dielectric low-temperature silicate lithium aluminum microwave dielectric ceramic material of the present application has the chemical general formula:LiB x Al 1‑x SiO4;Wherein, 0.02≤x≤0.1, x represents molar mass.The ultra-low dielectric low-temperature silicate lithium aluminum microwave dielectric ceramic material of the present application has low dielectric constant and high quality factor and considerable resonance frequency temperature coefficient, has potential and is widely applied in manufacturing high-speed signal transmission medium antenna, microwave substrate, dielectric resonator and other microwave devices.

The application belongs to the field of microwave ferrite materials, and provides a garnet ferrite with high dielectric constant and high bending strength and a preparation method thereof, so as to solve the problems of abnormal grain growth and high porosity caused by excessive liquid phase in the sintering process of the existing high dielectric constant bismuth-substituted garnet ferrite, and the problem of low bending strength caused thereby. In the main phase system of the bismuth-containing microwave garnet ferrite, a proper amount of nano-SiO2 is introduced as a grain boundary regulator, which is conducive to forming a dense and uniform fine-grained microstructure and optimizing the ferromagnetic resonance line width; while maintaining the high dielectric constant endowed by the high polarization rate of bismuth ions, the fracture toughness and intrinsic strength of the ferrite are significantly improved by means of fine-grained strengthening mechanism, so that the bending strength of the ferrite is increased, thereby effectively solving the problems of micro-cracks and edge collapse easily occurring in the processing steps such as slicing, grinding and polishing of the high dielectric microwave substrate, and meeting the application requirements of miniaturization and high yield production of the microwave circulator and isolator.

The utility model discloses a fine needle group module for microwave circuit chip substrate punching processing belongs to chip substrate punching technical field, and this group module includes removal assembly, punch assembly, storage box and drain pipe, and the cleaning assembly is through the cleaning board of torsional spring connection, can be in the automatic contact of hollow type punching fine needle upward reset, removes the substrate debris of fine needle surface attachment, avoids the chip with fine needle secondary and takes into the hole or pollutes other area, and the cleaning assembly is through the storage of storage tank deionized water, after punching is completed, and starts solenoid valve can utilize external air pressure, makes deionized water through drain pipe accurate injection in the hole, removes the residual debris and processing impurity in the hole, compared with traditional manual cleaning or corrosive solution cleaning, and deionized water will not corrode fine needle, also will not destroy microwave substrate material quality, guarantees the cleaning effect simultaneously, protects the performance and fine needle life of substrate, reduces the rework rate of follow -up.

The utility model relates to the technical field of wireless communication, in particular to an on-chip antenna circuit system based on board-level welding, which comprises an antenna board, a digital board and a bonding pad structure, the antenna board is used for receiving and transmitting millimeter wave frequency band signals, the digital board is used for processing digital signals and control logic, and the bonding pad structure is used for connecting the digital board and the bonding pad structure. The antenna board and the digital board are directly welded through the bonding pad structure. The pad structure is directly welded to replace a traditional connector, high-reliability connection between the antenna board and the digital board is achieved, and the risk of mechanical contact failure is eliminated. The bonding pad structure adopts an integrated design of a radio frequency signal bonding pad, a digital signal bonding pad, a power supply bonding pad and a ground bonding pad, supports transmission of multiple types of signals, and improves the integration level; in the split-board structure, a high-cost high-frequency microwave substrate and a low-cost universal printed circuit board substrate are used, so that the material cost is remarkably reduced.

The invention relates to a microwave ultra-wideband coupling power detection device, which is used for performing power detection on a to-be-detected PCB (Printed Circuit Board), and comprises a shell unit, the shell unit comprises a sleeve and a connector assembly which are coaxially arranged, the sleeve and the connector assembly are connected to form an accommodating cavity, and the tail end of the sleeve is provided with a first through hole; the coupling unit comprises a central conductor and a microwave substrate assembly which are accommodated in the accommodating cavity; the central conductor is coaxially arranged on the connector assembly; the microwave substrate assembly comprises a first substrate assembly and a second substrate assembly; one end of the first substrate assembly is elastically connected with the central conductor, and the other end of the first substrate assembly is elastically connected with the second substrate assembly. On the premise that an original circuit structure and overall functions are not affected, the power of each node in microwave PCB circuit debugging can be accurately detected, so that online accurate measurement of the power of each node of the microwave PCB circuit is realized, a tested object can be ensured to be intact, and the tested circuit is prevented from being damaged.

The invention discloses a broadband integrated low-profile phased array integrated network. A monitoring network is located right above an aperture transformation network. The aperture transformation network is of a microstrip line or strip line structure and comprises a first lower-layer signal feeder line, a first middle-layer microwave substrate and a first upper-layer metal floor which are sequentially stacked from bottom to top. The main body part of the monitoring network adopts a substrate integrated waveguide structure, and comprises a substrate integrated waveguide coupling power divider, a broadband gradient impedance matching structure, a microstrip feeder line and a terminal absorption load. According to the invention, the aperture transformation network and the monitoring network are integrated through the multilayer microwave plate vertical interconnection processing technology, the number of hardware equipment is reduced, the spatial layout is optimized, the integration level of the system is improved, and the system has the characteristics of miniaturization, light weight and easy processing. Furthermore, a substrate integrated waveguide coupling power divider is adopted, amplitude and phase data of signals in each channel can be extracted independently, electromagnetic interference of the external environment can be shielded through a closed structure, and calibration precision and consistency of monitoring signals between the channels are improved.

The application discloses a phosphate-based low-dielectric LTCC material and a preparation method thereof. A O-MgO- x P2O5, wherein A =Sr, Ca or Sr 1‑y Ca y , 1.0<= x <=1.2, 0< y <=0.2. The preparation process is as follows: LTCC ceramic powder synthesis, ball milling, compression molding, sintering into ceramic. The main crystal phase of the phosphate-based low-dielectric LTCC material is Na2AMg(PO4)2, wherein A =Sr, Ca or Sr 1‑y Ca y , has the advantages of low raw material cost, low sintering temperature (750-900 DEG C), low dielectric constant (8.2-9.3), high Q f value (41800-80310 GHz), simple preparation process, good reproducibility and the like, and can solve the time delay problem of microwave signals in high-frequency communication, improves the stability of microwave signal transmission, and is very suitable for being used as an LTCC microwave substrate, a dielectric antenna and the like.

The invention discloses an integrated reflow welding tool and method for multi-dimensional parts of a microwave assembly. The tool comprises a center positioning module and upper, lower, left and right dimension pressure applying modules; a positioning groove is formed in the middle of the center positioning module and used for containing a box body, a pushing and pressing elastic device is arranged on the inner side wall of the positioning groove and used for positioning the box body in the positioning groove, and positioning pins are arranged on the upper side, the lower side, the left side and the right side of the center positioning module; elastic locking mechanisms connected with the positioning pins are arranged at four corners of an upper cover plate and a lower cover plate of the upper dimension pressure applying module and the lower dimension pressure applying module, and a plurality of single-point elastic pressing tools are fixed on the upper cover plate and the lower cover plate and used for pressing the microwave substrate and the power panel respectively; a left cover plate and a right cover plate of the left dimension pressure applying module and the right dimension pressure applying module are provided with elastic locking mechanisms connected with the positioning pins, and a plurality of single-point elastic pressing tools are fixed to the left cover plate and the right cover plate and used for pressing a power connector and a radio frequency connector. According to the invention, multi-dimensional integrated assembling and welding of multi-dimensional high-integration microwave assembly parts can be realized.

The invention discloses a bismaleimide-triazine resin (BT)-based high-frequency composite dielectric substrate suitable for the field of microwave substrates and a preparation method of the bismaleimide-triazine resin (BT)-based high-frequency composite dielectric substrate. According to the substrate, a bismaleimide-triazine resin composition is used as matrix resin, spherical silicon dioxide with a low dielectric constant is used as a filling material, and the composite substrate with the low dielectric constant, the low dielectric loss and the low thermal expansion coefficient is obtained. Meanwhile, the problem that the original thermal conductivity of the BT resin is poor is also improved. The raw materials selected by the method are easy to obtain, the preparation process is simple and controllable, the preparation process is low in energy consumption and short in time consumption, and the method can be applied to the high-speed and high-frequency field and has wide application prospects.

The embodiment of the invention relates to the technical field of communication, and discloses an antenna unit and a communication device, the antenna unit and the communication device comprise a dielectric substrate, a substrate integrated waveguide structure, a radiation slot and a coplanar waveguide feed structure, the substrate integrated waveguide structure is arranged in the dielectric substrate, and the coplanar waveguide feed structure is arranged in the radiation slot. The substrate integrated waveguide structure is formed by a plurality of conductive assemblies arranged along a preset path, the plurality of conductive assemblies penetrate through the thickness direction of the dielectric substrate, the radiation slot is located in a coverage area of the substrate integrated waveguide structure, the coplanar waveguide feed structure is electrically connected with the substrate integrated waveguide structure, and the coplanar waveguide feed structure is electrically connected with the dielectric substrate. And the antenna is used for feeding to the radiation slot. Through the above mode, the embodiment of the invention can effectively solve the technical problem of low antenna radiation efficiency caused by overlarge dielectric loss of a conventional microwave substrate in the prior art by adopting a combination scheme of the low-loss dielectric substrate and the substrate integrated waveguide structure.