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Substrate support equipment and substrate processing equipment

A technology for supporting equipment and processing equipment, used in the manufacture of discharge tubes, electrical components, semiconductor/solid-state devices, etc., and can solve problems such as uneven curing or burning of photoresist patterns, uneven substrate temperature, and increased cost. , to reduce the number, improve temperature uniformity, and prevent processing failures

Active Publication Date: 2016-04-13
GIGALANE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This temperature increase of the top plate results in a temperature non-uniformity of the substrate around the opening of the top plate from which the top surface of the substrate is exposed.
Subsequently, this temperature increase produces uneven curing or burning in the photoresist pattern formed on the substrate for plasma etching, causing process failure
[0006] Also, since several O-rings are used, the position of the O-rings can be easily changed when coupling the bottom plate with the top plate
This can lead to problems such as difficult coupling and increased cost

Method used

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  • Substrate support equipment and substrate processing equipment
  • Substrate support equipment and substrate processing equipment
  • Substrate support equipment and substrate processing equipment

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Embodiment Construction

[0036] Embodiments according to the present invention will now be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below, but can be embodied in various configurations. These embodiments are provided for comprehensive understanding of the present invention, and the scope of the present invention can be fully understood by those skilled in the art with reference to these embodiments. The sizes of elements in the drawings may be partially exaggerated to clearly illustrate the embodiments. Like reference numerals in the drawings indicate like elements.

[0037] Hereinafter, a substrate supporting apparatus and a substrate processing apparatus according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0038] figure 1 is a cross-sectional view of a substrate support apparatus according to an embodiment of the present inven...

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Abstract

The invention provides a substrate support apparatus and a substrate processing apparatus. The substrate support apparatus comprises: a bottom plate configured to allow a substrate to be supported on the bottom plate, and having a plurality of supply pipes for cooling air to flow through; a top plate configured to be detachably coupled to the bottom plate, and having an opening to expose the top surface of the substrate supported on the bottom plate; and a sealing member configured to be coupled to the bottom plate, and forming cooling spaces between the top plate and the bottom plate and between the substrate and the bottom plate. According to the apparatus provided by the invention, thermal conductive gas is supplied to multiple substrates to increase the thermal transmission efficiency.

Description

technical field [0001] The present invention relates to substrate support apparatus and substrate processing apparatus, and more particularly, to substrate support apparatus and substrate processing apparatus that can apply heat transfer gas to multiple substrates to improve heat transfer efficiency. Background technique [0002] In general, a plasma processing apparatus for manufacturing devices such as semiconductors, LEDs, and flat panel displays generates plasma by forming an electric field and a magnetic field in a reaction chamber, and performs various processes using the plasma. Conventional plasma processing equipment includes a substrate support for holding a substrate thereon, and in particular, this substrate support may have a configuration for simultaneously holding and processing multiple substrates for production improvements . While performing this plasma treatment process, the temperature of the substrate mounted on the substrate support device increases du...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67109H01L21/68785H01J37/32715H01L21/67069H01L21/67126
Inventor 郑相坤金亨源申裕植
Owner GIGALANE CO LTD
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