Thermoelectric conversion structure and its use in heat dissipation device
A technology of thermoelectric conversion and heat dissipation structure, which is applied in the direction of thermoelectric device parts, circuits, electrical components, etc., can solve the problems of Joule heat, increased heat backflow, and reduced thermoelectric cooling capacity, and achieve the effect of reducing thermal conductivity
Active Publication Date: 2014-01-29
IND TECH RES INST
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Problems solved by technology
The interface resistance will cause Joule heat, and the thermal resistance will aggravate the phenomenon of heat reflow, which will lead to the reduction of thermoelectric cooling capacity
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[0046] The technical solutions of the present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments to further understand the objectives, solutions and effects of the present invention, but not as a limitation of the protection scope of the appended claims of the present invention.
[0047] Please refer to figure 1 , Is a cross-sectional view of the thermoelectric conversion structure 10 according to an embodiment of the present invention. The thermoelectric conversion structure 10 of the present invention includes a thermoelectric conversion unit 11, a heat-absorbing electrode 12 and a conductive thermal layer 13. The thermoelectric conversion structure 10 further includes a heat releasing electrode 14 and a conductive heat dissipation layer 15. The heat absorption electrode 12 is disposed at a first end 111 of the thermoelectric conversion unit 11. The conductive resistance thermal layer 13 is disposed between the th...
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Abstract
The disclosure provides a thermoelectric conversion structure and its use in heat dissipation device. The thermoelectric conversion structure includes a thermoelectric element, a first electrode and an electrically conductive heat-blocking layer. The thermoelectric element includes a first end and a second end opposite to each other. The first electrode is located at the first end of the thermoelectric element. The electrically conductive heat-blocking layer is between the thermoelectric element and the first electrode. The heat dissipation device comprises at least one first thermoelectric conversion structure and at least one second thermoelectric conversion structure which are arranged adjacently. Electrons can cross the electrically conductive heat-blocking layer, but phonons can be insulated by the electrically conductive heat-blocking layer. The invenion has a thermoelectric conversion structure and a heat dissipation device, becasue electrons can cross the electrically conductive heat-blocking layer for maintaining the electric conductivity of the thermoelectric conversion structure and the dissipation strucutre, and by means of the electrically conductive heat-blocking layer. Phonons is not matched with the material at the interface by means of the electrically conductive heat-blocking layer, thereby generating scattering mechanism and reducing whole thermal conductivity.
Description
Technical field [0001] The present invention relates to a thermoelectric conversion structure and a heat dissipation structure using the same, in particular to a thermoelectric conversion structure using the Peltier effect and a heat dissipation structure using the same. Background technique [0002] Most of the current heat dissipation technologies use fans and heat pipes for heat dissipation. However, the above methods can only keep the object to be dissipated at room temperature or a temperature above room temperature, and cannot reduce its temperature below room temperature. [0003] Therefore, some companies use the Peltier effect to produce active refrigeration elements that can actively direct heat to a specific direction. The principle of such a refrigeration element is to pass a direct current on a circuit formed by connecting two different metal materials, one of which will release heat while the other will absorb heat. Since the heat is actively moved by current or ele...
Claims
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IPC IPC(8): H01L35/02H01L35/28H01L23/38H10N10/80H10N10/10
Inventor 徐晓萱郑淳护周雅文林育立
Owner IND TECH RES INST