Thermal interface materials and methods for processing the same
A thermal interface material, heat transfer surface technology, applied in heat transfer modification, heat exchange equipment, lighting and heating equipment, etc., can solve problems such as the operation of devices that affect the operating characteristics of electrical components
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Embodiment 1
[0065] In this example, four samples of thermal transfer putty (a silicone gap filler product) were used to evaluate the presence of entrapped gas. The thermally conductive putty has a thermal conductivity of about 3 watts / meter-Kelvin (W / mK) and a density of about 2.4 grams per cubic centimeter (g / cc).
[0066]The first sample consisted of a monolithic ball of thermally conductive putty exposed to ambient laboratory conditions for about 24 hours. The sample was then immersed in degassed liquid silicone in a clear glass jar, and the jar was placed in a vacuum chamber (with a clear window for viewing the sample). An increasing vacuum was drawn on the interior of the vacuum chamber, resulting in a final low pressure of about 127 Torr (about 5 inHg abs) in the chamber (the chamber yielded a gauge reading of about -25 inHg). The samples were kept at this low pressure in the chamber for about 1 hour, after which the following observations were made. Bubbles began to form on the s...
Embodiment 2
[0071] In this example, thermal cycle analysis was performed on two thermal transfer putty samples (silicone thermal gap filler products). The heat transfer putty has a thermal conductivity of about 3 W / mK and a density of about 1.5 g / cc.
[0072] A first sample of the thermal putty was placed in a container and subjected to reduced pressure. Specifically, the gas was removed from the container (to remove all the samples from the sample in the container) by applying a vacuum of about 381 Torr (about 15 inHg abs) to the container and thermal putty for about 5 minutes (to allow the first sample to be vacuum conditioned). Entrained gas). The second sample of thermal putty was not subjected to reduced pressure (so it was not vacuum conditioned). Thermal cycling analysis was then immediately performed on the first and second samples. Each sample was placed between a pair of glass plates so that the effect of thermal cycling analysis could be easily observed. A spacer separates ...
Embodiment 3
[0074] In this example, thermal cycle analysis was performed on two thermal transfer putty samples (silicone thermal gap filler products). The thermally conductive putty had a thermal conductivity of about 2 W / mK and a density of about 3.0 g / cc.
[0075] A first sample of the thermal putty was placed in a container and subjected to reduced pressure. In particular, the gas was removed from the container (to remove the entrained sample from the sample in the container) by applying a vacuum of about 381 Torr (about 15 inHg abs) to the container and sample for about 5 minutes (to allow the first sample to be vacuum conditioned). gas). The second sample of thermal putty was not subjected to reduced pressure (so it was not vacuum conditioned). Thermal cycling analysis was then immediately performed on the first and second samples. Each sample was placed between a pair of glass plates so that the effect of thermal cycling analysis could be easily observed. A spacer separates each...
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