Leak detection method of electronic device

Abstract

The invention relates to the technical field of electronic circuits, in particular to a leak detection method of an electronic device. The method includes the following steps that the electronic device to be detected is placed into a pressurizing container, and after the container is vacuumized, pressurizing is carried out on the electronic device through high-pressure tracer gas helium with the purity of 99.999%; after pressurizing is finished, the electronic device is directly soaked in light fluorocarbon oil, and judgment is carried out by observing whether the electronic device bubbles; the detected electronic device which is qualified in bubbling is placed into a vacuum container, and leakage rate testing and judging are carried out by means of a helium mass spectrometer vacuum leak detection method. By means of the leak detection method, on the situation that original equipment is used, leak detection efficiency is improved, purifying is not needed, new defects are avoided, and meanwhile leak detection cost is saved.

Description

technical field [0001] The invention relates to the technical field of electronic circuits, in particular to a leak detection method for electronic devices. Background technique [0002] Electronic components are an indispensable part of electronic products, and their quality directly affects the quality of various equipment. Electronic products must have the ability to resist external environment corrosion, so many electronic devices are required to be sealed. This first prevents the chips and circuits in the device from communicating with the external environment, especially those with high humidity, so as to avoid electrolytic corrosion and change the electrical parameters of the device, resulting in performance degradation, and even serious damage to the device. The fusing structure is damaged and the device is scrapped. Secondly, some devices are required to work under a certain gas protection, or work in a vacuum environment, or when the device is required to be seal...

AI Technical Summary

Problems solved by technology

[0007] After each decompression, the surface adsorption problem must be surface treated. Whether it is helium or fluorine oil, improper treatment of the purification effect will cause misjudgments or missed judgments in leak detection, affecting the final result.

[0008] (3) May introduce new defects

[0009] Due to the use of high-temperature hot fluorine oil for bubbling, new defects may be generated due to sudden changes in temperature when the device under test goes directly from room temperature to high temperature

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