Image sensor packaging structure and packaging method thereof

Abstract

Disclosed are an image sensor packaging structure and a packaging method of the image sensor packaging structure. The packaging method comprises the steps of providing a first substrate, forming welding discs comprising a plurality of image sensing areas and a plurality of surrounding image sensing areas on the upper surface of the first substrate, providing a second substrate, forming a plurality of cavities in the second substrate, forming an adhesive tape film on the upper surface of the second substrate, conducting press fit on the lower surface of the second substrate and the upper surface of the first substrate to enable the image sensing areas to be located in the cavities, cutting and removing an adhesive tape film between adjacent cavities and the partial thickness of the second substrate, forming cavity walls of the surrounding image sensing areas and adhesive tape layers located in closed cavities in the top surfaces of the cavity walls, removing the remaining second substrate, arranged on the first substrate, between the cavities, exposing the surfaces of the welding discs, conducting segmentation on the first substrate to form single image sensor chips, and electrically connecting the welding discs on the image sensor chips with a circuit on a third substrate through wires. The method prevents the image sensing areas from being polluted or damaged.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to an image sensor packaging structure and a packaging method thereof. Background technique [0002] Image sensors receive light signals from objects and convert them into electrical signals that can be transmitted for further processing, such as digitization, and then stored in a storage device such as memory, optical or magnetic disks, or for display on a display display etc. Image sensors are commonly used in devices such as digital still cameras, video cameras, scanners, facsimile machines, and the like. Image sensors generally include charge-coupled device (CCD) image sensors and CMOS image sensors (CIS, CMOS Image Sensor). Compared with CCD image sensors, CMOS image sensors have the advantages of high integration, low power consumption, and low production cost. [0003] As the size of the image sensor becomes smaller and smaller, the number of pads increases and the spa...

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Problems solved by technology

[0006] The problem solved by the present invention is how to prevent chip contamination or damage during the packaging process of image sensor chips, and improve the production efficiency of packaging

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