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On-chip integrated bulk wave resonator and manufacturing method thereof

An integrated body and manufacturing method technology, applied in the direction of electrical components, impedance networks, etc., can solve the problems of occupation, unfavorable chip size miniaturization, and reduce the chip size of body wave filters, etc., to achieve the effect of reducing the integration space and size

Active Publication Date: 2017-08-01
ROFS MICROSYST TIANJIN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0012] Aiming at the problem that the energy storage element in the bulk wave filter chip occupies an additional chip area in the related art, which is not conducive to further miniaturization of the chip size, the present invention proposes an on-chip integrated bulk wave resonator and its manufacturing method, which can store The energy components are integrated into the body wave resonator, which is beneficial to further reduce the size of the body wave filter chip

Method used

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  • On-chip integrated bulk wave resonator and manufacturing method thereof
  • On-chip integrated bulk wave resonator and manufacturing method thereof
  • On-chip integrated bulk wave resonator and manufacturing method thereof

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Embodiment Construction

[0064] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

[0065] According to an embodiment of the present invention, an on-chip integrated bulk wave resonator is provided.

[0066] A bulk wave resonator according to an embodiment of the present invention may include:

[0067] Bulk wave resonator;

[0068] At least one energy storage element, wherein the energy storage element may include capacitance and / or inductance or other energy storage elements for the bulk wave resonator, at least part of the at least one energy storage element is located in...

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Abstract

The invention discloses an on-chip integrated body wave resonator and a manufacturing method thereof, wherein the body wave resonator comprises: a body wave resonator; at least one energy storage element, wherein at least part of the at least one energy storage element is located in the body The wave resonator is within the range of the projected area in the vertical direction. The present invention integrates the energy storage element into the projection area of ​​the bulk wave resonator in the vertical direction, thereby effectively reducing the integration space of the energy storage element and the bulk wave resonator, which is beneficial to further reducing the size of the bulk wave filter chip.

Description

technical field [0001] The present invention relates to the field of semiconductors, and in particular, to an on-chip integrated bulk wave resonator and a manufacturing method thereof. Background technique [0002] In terms of mobile phone communication and high-speed serial data applications, thin-film piezoelectric bulk wave resonators made of piezoelectric thin-film longitudinal resonance in the thickness direction have become a viable alternative to surface acoustic wave devices and quartz crystal resonators. . The RF front-end bulk wave piezoelectric filter / duplexer provides superior filtering characteristics, including: low insertion loss, steep transition band, large power capacity, strong anti-electrostatic discharge (ESD) ability, etc. High-frequency thin-film piezoelectric bulk wave oscillators have ultra-low frequency temperature drift, and they have low phase noise, low power consumption, and large bandwidth modulation range. In addition, these miniature thin-f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H03H9/15H03H9/02H03H3/02
Inventor 庞慰江源张代化张浩
Owner ROFS MICROSYST TIANJIN CO LTD
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