Novel compound semiconductor and usage for same
A semiconductor and compound technology, applied in the field of new compound semiconductor materials, to achieve good thermoelectric conversion performance, improve thermal conductivity, and increase the effect of ZT value
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[0071] Prepare 0.0497g In, 0.0113g Zn, 0.3522g Co, 0.0713g Rh, 2.2149g Sb, 0.1028g Sn, 0.1768g Te and 0.0209g Co 3 o 4 As a reagent, and use a mortar and mortar for mixing. The material mixed as above was put into a quartz tube and vacuum-sealed, then heated at 650 °C for 36 hours. The time taken to raise the temperature to 650°C was 1 hour and 30 minutes, and In 0.25 Zn 0.1 co 3.6 Rh 0.4 Sb 10.5 sn 0.5 o 0.2 Te 0.8 powder.
[0072] A part of the composite material prepared above was formed into a disc having a diameter of 10 mm and a thickness of 1 mm. Thereafter, a pressure of 200 MPa was applied to the disk using CIP (cold isostatic pressing). Next, the resulting product was put into a quartz tube and vacuum sintered for 12 hours. For the sintered discs, thermal conductivity was measured at pre-set temperature intervals using an LFA457 (Netzsch, Inc). The measurement results are shown as examples in figure 1 middle.
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