Crystalline silicon solar cell and manufacturing method thereof
A technology of a solar cell and a manufacturing method, applied in the field of solar cells, can solve problems such as low light absorption rate, and achieve the effect of avoiding absorption
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Embodiment 1
[0035] The above-mentioned silicon nitride film structure was fabricated by the plate PECVD model of Roth&Rau XL, and the microwave power of the tubular PECVD was set to 3000W, the temperature was 350°C, and the air pressure was 0.27mbar. The substrate is placed in the above-mentioned plate-type PECVD reaction chamber with the back facing up, and the first reaction gas with a flow ratio of SiH4 and NH3 of 1:1 is introduced into the PECVD reaction chamber through the first quartz tube, and the first silicon nitride film is formed after about 2 minutes ; Use the second quartz tube to feed SiH into the PECVD reaction chamber 4 and NH 3 The second reaction gas with a flow ratio of 1:2 forms the second silicon nitride film after about 2 minutes; uses the third quartz tube to feed SiH into the PECVD reaction chamber 4 and NH 3 The third reaction gas with a flow ratio of 1:4 will form the third silicon nitride film after about 2 minutes; use the fourth quartz tube to feed the fourt...
Embodiment 2
[0038] The above-mentioned silicon nitride film structure is produced by using the tubular PECVD model of Jiejiachuang PD-380. The RF power of the tubular PECVD is set to 6000W, the temperature is 430°C, and the air pressure is 1600mTorr. The specific process is: the anti-reflection layer will be completed The silicon substrate after deposition is placed in the above-mentioned tubular PECVD reaction chamber with the back facing up, and SiH is introduced into the PECVD reaction chamber. 4 and NH 3 The first reaction gas with a flow ratio of 1:1 forms the first silicon nitride film after about 1 minute; the second reaction gas with a flow ratio of SiH4 and NH3 of 1:3 is introduced into the PECVD reaction chamber, and the second silicon nitride film is formed after about 1 minute. Silicon nitride film; SiH is introduced into the PECVD reaction chamber 4 and NH 3 The third reaction gas with a flow ratio of 1:6 forms the third silicon nitride film after about 1 minute; the fourth...
Embodiment 3
[0041] The above-mentioned silicon nitride film structure is produced by using the tubular PECVD model of CentrothermE200-410-4. The discharge power of the tubular PECVD is set to 6000W, the temperature is 450°C, and the air pressure is 1500mTorr. The specific process is: the deposition of the anti-reflection layer will be completed Afterwards, the silicon substrate is placed in the above-mentioned tubular PECVD reaction chamber with the back facing up, and SiH is introduced into the PECVD reaction chamber. 4 and NH 3 The flow ratio of the first reaction gas is 1:1, and the first silicon nitride film is formed after about 2 minutes; SiH is introduced into the PECVD reaction chamber 4 and NH 3 The second reaction gas with a flow ratio of 1:3 forms the second silicon nitride film after about 2 minutes; SiH is introduced into the PECVD reaction chamber 4 and NH 3 The third reaction gas with a flow ratio of 1:6, and the third silicon nitride film is formed after about 2 minutes...
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