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Novel lead frame material stress releasing device

A material stress release device technology, applied in the field of integrated circuits, can solve the problems of poor softening resistance of copper strips, and achieve the effect of simple and reasonable structure and convenient roll replacement

Active Publication Date: 2015-06-17
JIANGSU YANGYANG CHEM EQUPIMENTS MFR
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a lead frame material stress release device, which has a simple and reasonable structure, is convenient to operate and change rolls, and can solve the problem of poor softening resistance of the copper strip due to incomplete internal stress release

Method used

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  • Novel lead frame material stress releasing device

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Embodiment Construction

[0010] Below in conjunction with accompanying drawing, the present invention is done the explanation of requirement one step:

[0011] With reference to accompanying drawing, a kind of lead frame material stress releasing device comprises pressing down motor 10, lead screw reducer 12, feeding trolley 1, unloading trolley 15, it is characterized in that: two pressing down motors 10 are decelerated with leading screw respectively The machine 12 is connected, the lead screw reducer 12 is connected with the pressing screw 11, the pressing screw 11 is connected with the upper roller system 6, the lower roller system 13 is arranged under the upper roller system 6, and the uncoiler is arranged on the left side of the lower roller system 13 2. A coiler 8 is arranged on the right side, and a left nip roller 4 and a right nip roller 14 are respectively arranged on the uncoiler 2 and the coiler 8; a left tension roller 5 is arranged between the lower roller system 13 and the uncoiler 2 ,...

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Abstract

A novel lead frame material stress releasing device comprises screwdown motors, a screw rod reducer, a charging trolley and a discharging trolley, wherein the two screwdown motors are connected with the screw reducer respectively; the screw rod reducer is connected with a screwdown screw rod; the screwdown screw rod is connected with an upper roll system; a lower roll system is arranged below the upper roll system; an uncoiling machine is arranged on the left surface of the lower roll system; a coiling machine is arranged on the right surface of the lower roll system; a left pressing roll and a right pressing roll are respectively arranged on the uncoiling machine and the coiling machine; a left tensioning roll is arranged between the lower roll system and the uncoiling machine; a right tensioning roll is arranged between the lower roll system and the coiling machine. The novel lead frame material stress releasing device is simple and reasonable in structure and convenient for operation and changing rolls, solves the problem that a copper belt has poor softening resistance caused by incomplete stress release, and is applicable to the field of integrated circuits.

Description

technical field [0001] The invention relates to the field of integrated circuits, in particular to a stress release device for lead frame materials C19210 and C19400. Background technique [0002] Human society has entered the information age. The core of this era is the integrated circuit, also known as the IC industry. The integrated circuit is composed of three parts: a chip, a lead frame, and a plastic package. The role of the lead frame is to conduct electricity, dissipate heat, and connect external circuits. Therefore, It is required that the lead frame material must have high strength, high conductivity, and good stamping and etching properties. At present, 80% of the lead frames in the world are made of copper alloy high-precision strips. According to incomplete statistics, there are about 77 types of lead frame alloys. According to the alloy system, there are three series: Cu-Fe-P (copper-iron-phosphorus), Cu-Ni-Si (copper-nickel-silicon), and CU-Cr-Zr (copper-chrom...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22F1/08
Inventor 仇文秋
Owner JIANGSU YANGYANG CHEM EQUPIMENTS MFR
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