Heat tube cooling system and power equipment

Abstract

The invention discloses a heat tube cooling system and power equipment. The heat tube cooling system comprises first heat exchange tubes, a first heat exchange plate, a second heat exchange plate, second heat exchange tubes and a condensing unit, or the heat tube cooling system comprises the first heat exchange tubes, a heat exchange device with a cavity, the second heat exchange tubes and the condensing unit. In the working process, heat conduction between a heating device and the condensing unit can be achieved, and in the overhauling process, the heating device and the condensing unit can be separated and can be respectively maintained. The power equipment comprises the heat tube cooling system, an equipment cabinet and electronic components. By means of the heat tube cooling system and the power equipment, the heating device and the condensing unit can be mutually detached, the heating device is mounted inside the equipment cabinet, the condensing unit is mounted outside the equipment cabinet, during daily maintenance, the heating device and the condensing unit are separated, the inside of the cabinet and the outside of the cabinet can be respectively maintained, and thus the maintaining and cleaning work can be completed rapidly.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a heat pipe heat dissipation system and power equipment. Background technique [0002] With the continuous development of electronic technology, the degree of circuit integration of semiconductor devices is getting higher and higher, the power of electronic components is getting larger and the physical size is getting smaller and smaller, and the heat flux density of power electronic products is also increasing. The heat dissipation requirements of electronic products are higher. Because the loop heat pipe has the advantages of high thermal conductivity, simple structure, small size, and light weight, heat pipe radiators are mostly used in the prior art to dissipate heat from power electronic products. [0003] Heat pipe radiators in the prior art generally include an evaporator, a compensator, and a condenser connected as a whole. The above components are connected into...

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Problems solved by technology

[0006] In order to solve the problem of inconvenient maintenance of heat pipe radiators in the prior art, embodiments of the present invention provide a heat pipe cooling system and power equipment

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