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Chip-level ultra-miniature refrigerator for uncooled infrared detector

An infrared detector and refrigerator technology, applied in the field of micro-electromechanical systems, can solve the problems of large mechanical motion noise, poor reliability, heavy weight, etc., and achieve the effects of small thermal inertia, prevention of heat conduction, and simple structure

Active Publication Date: 2018-09-04
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Traditional chip-level thermoelectric, thermoacoustic, microfluidic, and MEMS Stirling refrigerators have defects such as large size, heavy weight, poor reliability, and large mechanical motion noise, which limits their popularization and application.

Method used

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  • Chip-level ultra-miniature refrigerator for uncooled infrared detector
  • Chip-level ultra-miniature refrigerator for uncooled infrared detector
  • Chip-level ultra-miniature refrigerator for uncooled infrared detector

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Embodiment Construction

[0026] The technical solutions provided by the present invention will be described in detail below in conjunction with specific examples. It should be understood that the following specific embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention.

[0027] The chip-level ultra-miniature refrigerator for unrefrigerated infrared detector provided by the invention, such as figure 1 As shown, it consists of two parts, including an outer packaging layer structure 1 and an inner refrigerator structure 5 . The inner refrigerator structure 5 is pasted on the bottom heat dissipation layer 1-4 of the outer packaging layer structure 1 . The outer encapsulation layer structure 1 is composed of a heat dissipation layer 1-4, a radiation protection layer 1-3, a vacuum encapsulation shell 1-2, and an infrared sensitive window 1-1 is set. The inner refrigerator structure 5 is composed of three parts, including an upper stru...

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PUM

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Abstract

The present invention provides a chip-level ultra-miniature refrigerator for an uncooled infrared detector. The chip-level ultra-miniature refrigerator comprises an outer-layer package layer structureand an inner-layer refrigerator structure; the outer-layer package layer structure comprises a vacuum package housing, an anti-radiation layer and a radiation layer, and the top portion of the vacuumpackage housing is provided with an infrared sensitive window; the inner-layer refrigerator structure comprises an upper-layer structure, a middle-layer structure and a lower-layer structure. The chip-level ultra-miniature refrigerator performs heating and cooling of a nano-film thermoelectric layer to maintain a constant temperature so as to effectively block the heat exchange between a supportstructure and an external environment through a substrate, and a heat insulation layer is laid at the bottom portion of the substrate to further inhibit the heat conduction of the external environment. An annular cantilever beam and the support structure further avoid heat conduction, the heat insulation layer is arranged to further inhibit the internal heat conduction and exchange so as to achieve heat insulation between the infrared detector and the external environment. The anti-radiation layer is deposited and grown to inhibit heat radiation, and a vacuum package method is employed to avoid heat convection and exchange of the internal portion and the external portion.

Description

technical field [0001] The invention relates to a chip-level ultra-miniature refrigerator for an unrefrigerated infrared detector, which belongs to the technical field of micro-electromechanical systems. Background technique [0002] Different from traditional mechanical microrefrigerators, chip-level ultramicrorefrigerators based on nano-film materials have the advantages of simple structure, variable size and shape, high integration, high heat flux density, small thermal inertia, fast temperature control and cooling speed, and no It needs refrigeration medium, does not produce mechanical noise and other advantages, and solves the refrigeration problem in various occasions. It has broad application prospects in the fields of electronic power, national defense, industry, scientific research, and life, especially in the application of refrigeration for micro-miniature infrared detectors, and has a huge application prospect. [0003] Traditional chip-level thermoelectric, the...

Claims

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Application Information

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IPC IPC(8): H01L31/024H01L25/16H01L35/28
CPCH01L25/167H01L31/024H10N10/10
Inventor 杨波冯雨郭鑫李成高小勇
Owner SOUTHEAST UNIV
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