Circuit board and manufacturing method thereof
A manufacturing method and circuit board technology, which is applied in printed circuit manufacturing, printed circuit, printed circuit, etc., can solve the problems of small distribution density of conductive bump structures, unfavorable dense distribution of multiple conductive bump structures, etc.
Active Publication Date: 2016-12-28
礼鼎半导体科技秦皇岛有限公司 +1
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AI Technical Summary
Problems solved by technology
Such a manufacturing method determines that the distribution density of the manufactured conductive bump structures is small, which is not conducive to the dense distribution of multiple conductive bump structures.
Method used
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Embodiment Construction
[0035] The circuit board manufacturing method provided by the technical solution includes the following steps:
[0036] For a first step, see figure 1 , providing a circuit substrate 110 .
[0037] The circuit substrate 110 includes a base 111 and a conductive circuit layer 112 .
[0038] The circuit substrate 110 may be a single-layer circuit substrate or a multi-layer circuit substrate. When the circuit substrate 110 is a single-layer circuit substrate, the base 111 is a single-layer dielectric layer. When the circuit substrate 110 is a multilayer circuit substrate, the base 111 may be a structure in which multiple layers of conductive circuits and multiple layers of dielectric layers are alternately stacked. The conductive circuit layer 112 is in contact with a dielectric layer of the substrate 111 . In this embodiment, the conductive circuit layer 112 includes a plurality of conductive pads 1121 arranged in an array. It can be understood that the conductive circuit la...
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A circuit board includes a substrate, a conductive circuit layer, a solder resist layer, an activated metal layer, a second metal seed layer and a metal bump, the conductive circuit layer is formed on the surface of the substrate, and the conductive circuit layer includes a plurality of conductive pads , the solder mask layer is formed on the surface of the conductive circuit layer and the surface of the substrate exposed from the conductive circuit layer, the solder mask layer contains a laser activation catalyst, and a plurality of penetration solder mask layers are formed in the circuit board and are connected with a plurality of conductive layers. One-to-one corresponding blind holes, the activated metal layer is formed by a laser-activated catalyst that activates the inner wall of the blind hole by laser, and is in contact with the solder mask layer, and the second metal seed layer is formed on the surface of the activated metal layer and On the surface of the corresponding conductive pad, metal bumps are formed on the surface of the second metal seed layer and protrude from the solder mask layer. The invention also provides a manufacturing method of the circuit board.
Description
technical field [0001] The invention relates to the field of circuit board production, in particular to a circuit board with conductive bumps and a production method thereof. Background technique [0002] A circuit board that uses a flip-chip ball grid array (FCBGA) to package chips usually needs to manufacture a plurality of conductive bump structures arranged in an array for carrying solder balls. The conductive bumps need to penetrate through the solder resist layer and be electrically connected to corresponding conductive lines. In the prior art, it is usually adopted to form a corresponding solder mask opening on the conductive circuit, then form an electroplating photoresist layer on the solder mask layer, and form a solder resist layer in the electroplating photoresist layer. The layer opening corresponds to the electroplated photoresist layer. Since both the openings of the solder resist layer and the openings of the electroplating photoresist layer need to be deve...
Claims
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IPC IPC(8): H05K1/11H05K3/40
CPCH05K3/244H05K3/4007H05K3/428H05K2201/09481H05K2201/09509H05K2201/09563H05K2201/099H05K2203/0571H05K2203/0577H05K2203/1383Y10T29/49167H05K3/3452H05K3/4046
Inventor 胡文宏
Owner 礼鼎半导体科技秦皇岛有限公司