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Adhesive for sealing thick film circuit

A thick film circuit and adhesive technology, applied in the direction of adhesives, adhesive types, non-polymer adhesive additives, etc., can solve problems such as easy failure and environmental pollution, and achieve the effect of improving life expectancy and environmental friendliness

Inactive Publication Date: 2014-03-19
陈顺美
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing adhesives for thick film circuit sealing have certain pollution to the environment, and the service life after curing is easy to fail under the sudden cooling and sudden heating of the temperature. Therefore, it is necessary to propose an adhesive that is stable to the temperature difference and is friendly to the environment.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] The invention provides an adhesive for thick-film circuit sealing, which comprises the following raw materials: 90g of epoxy resin, 9g of dibutyl phthalate, 8g of aluminum oxide, 5g of diethylenetriamine, and 2g of ethylenediamine. Wherein, Al2O3 is selected from 150-mesh sieve-grain and 200-mesh sieve-grain. Put it in a gel container and use it within 20 minutes after stirring evenly.

[0011] The above-mentioned adhesive for thick film circuit sealing is environmentally friendly and can tolerate a temperature difference of 15 degrees Celsius per hour.

Embodiment 2

[0013] The invention provides an adhesive for thick-film circuit sealing, which comprises the following raw materials: 110g of epoxy resin, 15g of dibutyl phthalate, 15g of aluminum oxide, 10g of diethylenetriamine, and 4g of ethylenediamine. Wherein, Al2O3 is selected from 150-mesh sieve-grain and 200-mesh sieve-grain. Put it in a gel container and use it within 20 minutes after stirring evenly.

[0014] The above-mentioned adhesive for thick film circuit sealing is environmentally friendly and can tolerate temperature changes within 16 degrees Celsius per hour.

Embodiment 3

[0016] The invention provides an adhesive for thick-film circuit sealing, comprising the following raw materials: 100 parts of epoxy resin, 12 parts of dibutyl phthalate, 12 parts of aluminum oxide, 8 parts of diethylenetriamine, 3 parts of ethylenediamine share. Wherein, Al2O3 is selected from 150-mesh sieve-grain and 200-mesh sieve-grain. Put it in a gel container and use it within 20 minutes after stirring evenly.

[0017] The above-mentioned adhesive for thick film circuit sealing is environmentally friendly and can tolerate temperature changes within 25 degrees Celsius per hour.

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PUM

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Abstract

The invention provides an adhesive for sealing a thick film circuit. The adhesive is prepared from the following raw materials in parts by weight: 90-110 parts of epoxy resin, 9-15 parts of dibutyl phthalate, 8-15 parts of aluminum oxide, 5-10 parts of diethylenetriamine and 2-4 parts of ethanediamine. The adhesive for sealing the thick film circuit provided by the invention is friendly to the environment, and capable of enduring the temperature difference change within 15 DEG C per hour; as a result, the service life of the product can be effectively prolonged.

Description

technical field [0001] The invention relates to the field of circuit sealing adhesive products, in particular to an adhesive for thick film circuit sealing. Background technique [0002] Integrated circuits are divided into thick film circuits, thin film circuits and semiconductor integrated circuits. There are two differences between thick film circuits and thin film circuits: one is the difference in film thickness, the film thickness of thick film circuits is generally greater than 10 μm, and the film thickness of thin films is less than 10 μm, mostly less than 1 μm; the second is the difference in manufacturing process, Thick-film circuits generally use screen printing technology. The most advanced material substrates use ceramics as substrates (more alumina ceramics are used). Thin-film circuits use vacuum evaporation, magnetron sputtering and other processes. The advantages of thick film circuits are reliable performance, flexible design, small investment, and low cos...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/06C09J11/04
Inventor 陈顺美
Owner 陈顺美