A liquid metal thermal interface material for 150°C and its preparation method

Abstract

The invention discloses a liquid metal thermal interface material used at 150 DEG C and a preparation method thereof. The liquid metal thermal interface material comprises the following components by weight percent: 24-28% of bismuth, 9-15% of zinc, 7-10% of tin, 3-5% of silver, 1-6% of copper and the balance of indium. The liquid metal thermal interface material designed by the invention has the beneficial effects that the liquid metal thermal interface material has low thermal resistivity and suitable volume viscosity, is not easy to fall from a contact surface and can fully fill the gap between a heating element and a heat dissipation element in an electronic device and improve the heat dissipation property of the electronic device; besides, the liquid metal thermal interface material overcomes the defects that traditional materials have low thermal conduction values and small thermal conduction areas and the viscosity of the materials is difficult to control; the thermal interface material has great advantages to be applied to and popularized in the electronic device; with further application and constant popularization of the thermal interface material in the electronic device industry, the novel thermal interface material is bound to gradually replace traditional thermal interface materials, become the predominant thermal interface material of the electronic device and simultaneously promote the development and application of the electronic device.

Description

technical field [0001] The invention relates to a liquid metal thermal interface material, in particular to a liquid metal thermal interface material for 150°C and a preparation method thereof. Background technique [0002] With the development of electronic products in the direction of light, thin, short and small, the operating temperature of electronic devices has also risen sharply. The interconnection density and interface contact between devices have a great influence on the thermal performance of the whole system. In order to ensure that electronic devices can operate at maximum efficiency at normal operating temperatures, effective heat dissipation must be carried out. In the way of heat dissipation from the inside to the outside of each component of an electronic product, in addition to relying on the installation of heat sinks and fans to improve heat dissipation efficiency, the thermal interface material used between the heating element and the heat dissipation ...

AI Technical Summary

Problems solved by technology

[0007] The purpose of this invention is to overcome the problem of excessive fluidity of the existing liquid metal that melts at 60°C, and to provide a liquid metal that can melt at about 150°C and liquid metal thermal interface materials that work around this temperature