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Wiring board

A technology of wiring substrates and conductive patterns, applied in printed circuits, printed circuit manufacturing, circuits, etc., can solve problems such as poor adhesion, peeling or cutting of plating layers, reliability problems of through holes, etc., to prevent reliability decline Effect

Inactive Publication Date: 2014-03-19
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the adhesion of the plating to the through hole is deteriorated, the plating layer will be peeled off or cut off due to the pressure during heating and cooling, which will cause problems in the reliability of the through hole.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0047] figure 2 It is a schematic cross-sectional view of the wiring board according to Embodiment 1. Wiring board 1 according to Embodiment 1 has a structure in which upper wiring pattern 11 is formed on the upper surface of insulating layer 10 and lower wiring pattern 12 is formed on the lower surface.

[0048] The insulating layer 10 has a thickness of 0.10 mm. An upper wiring pattern 11 is formed on the upper surface of the insulating layer 10 , and a lower wiring pattern 12 is formed on the lower surface. The upper wiring pattern 11 and the lower wiring pattern 12 each have a thickness of 0.10 mm and are formed at substantially identical positions in the thickness direction of the insulating layer 10 .

[0049]The upper wiring pattern 11 is integrally formed with a convex portion 11A protruding toward the lower side in the thickness direction, that is, the lower wiring pattern 12 side. In other words, the upper wiring pattern 11 and the convex portion 11A are formed o...

Embodiment approach 2

[0063] Next, a wiring board according to Embodiment 2 will be described. The wiring board according to the second embodiment differs from the first embodiment in that a wiring pattern is further laminated between the upper wiring pattern 11 and the lower wiring pattern 12 . Hereinafter, only this point of difference will be described.

[0064] Figure 4 It is a schematic sectional view of the wiring board concerning Embodiment 2. The wiring substrate 2 according to Embodiment 2 is, for example, Figure 4 As shown, a first intermediate layer wiring pattern 14 and a second intermediate layer wiring pattern 15 are further stacked between the upper wiring pattern 11 and the lower wiring pattern 12 in the insulating layer 10 . The first intermediate layer wiring pattern 14 is laminated on the lower wiring pattern 12 side, and the second intermediate layer wiring pattern 15 is laminated on the upper wiring pattern 11 side. That is, the upper wiring pattern 11 , the second interm...

Embodiment approach 3

[0079] Next, a wiring board according to Embodiment 3 will be described. The wiring board 3 according to the third embodiment differs from the first embodiment in that electronic components are mounted in the insulating layer of the wiring board according to the first embodiment.

[0080] Figure 7 is a schematic cross-sectional view of a wiring board according to Embodiment 3. In the wiring board 3 according to Embodiment 3, the lower wiring pattern 12 is formed integrally with the land 12B. Electronic components 15 are mounted on land 12B. Therefore, by embedding the electronic component 15 in the insulating layer 10, the size of the wiring board 3 can be reduced.

[0081] In addition, examples of the electronic component 15 include active elements such as silicon semiconductor elements and gallium arsenide semiconductor elements, passive elements such as capacitors and inductors, and the like.

[0082] Hereinafter, a method of manufacturing wiring board 3 according to E...

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PUM

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Abstract

This wiring board is provided with: an insulating layer (10); and an upper wiring pattern (11) and a lower wiring pattern (12) that are arranged so as to sandwich the insulating layer (10) therebetween. The lower wiring pattern (12) is provided with a truncated conical projection (12A) that protrudes toward the upper wiring pattern (11) and is integrally formed with the lower wiring pattern (12), while the upper wiring pattern (11) is provided with a truncated conical projection (11A) that protrudes toward the lower wiring pattern (12) and is integrally formed with the upper wiring pattern (11). The bonding end portions of the projections (11A, 12A) are bonded with each other, thereby forming an interlayer connection conductor (13). The interlayer connection conductor (13) electrically connects the upper wiring pattern (11) and the lower wiring pattern (12) with each other. Consequently, there is provided a wiring board which is free from decrease in the reliability of an interlayer connection conductor in order to have no negative effect of size reduction.

Description

technical field [0001] The present invention relates to a wiring board in which a conductor pattern is formed in an insulating layer. Background technique [0002] In a wiring board, interlayer connection conductors (via-hole conductors) that electrically connect wiring patterns between different layers are generally formed by providing through-holes (via-holes) on the wiring board and plating the inner walls of the through-holes. , to form the interlayer connecting conductor. However, if the adhesion of the plating to the through hole is deteriorated, the plating layer may be peeled off or cut due to pressure during heating and cooling, causing a problem in the reliability of the through hole. [0003] Patent Document 1 discloses a method of manufacturing a printed wiring board excellent in via hole reliability. figure 1 It is a schematic sectional view of the wiring board described in patent document 1. exist figure 1 In the printed wiring board shown, a protrusion of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/11
CPCH05K3/4038H05K2201/10378H01L23/5389H05K3/4614H05K1/188H05K3/4647H05K2203/0323H05K2203/0376H05K3/007H05K1/115H05K2203/0369H05K3/06H01L2924/0002H01L2924/00
Inventor 伊藤悟志守屋要一金森哲雄八木幸弘山本祐树
Owner MURATA MFG CO LTD
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