Heat dissipation shell of thin film capacitor

A film capacitor, heat dissipation shell technology, applied in the direction of thin film/thick film capacitor, fixed capacitor shell/package, multilayer capacitor, etc. problem, to achieve the effect of improving the heat dissipation effect, easy processing and convenient assembly

Active Publication Date: 2014-03-26
TONGLING YUANFENG ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above method has led to an increase in the manufacturing cost of film capacitors, and increased the difficulty of installing and fixing film capacitors, which has affected the miniaturization of equipment using film capacitors.

Method used

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  • Heat dissipation shell of thin film capacitor
  • Heat dissipation shell of thin film capacitor
  • Heat dissipation shell of thin film capacitor

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Embodiment Construction

[0019] The content of the present invention will be described below in conjunction with specific embodiments.

[0020] Such as Figure 1 to Figure 3 As shown, it is a structural schematic diagram of a heat dissipation shell of a thin film capacitor according to the present invention. The heat dissipation shell of a film capacitor according to the present invention includes: a cylindrical body for placing the film core 1, the body has a circular bottom wall 31 and a tubular side wall 32, the The edge of the bottom wall 31 is connected to the lower end of the side wall 32, and the inner wall of the upper end of the side wall 32 is provided with a thread 33; a cylindrical head for fixing the lead-out terminal 2, the head has An annular bottom wall 2 41 and a tubular side wall 2 42, the lower end of the side wall 2 42 is connected to the annular outer edge of the bottom wall 2 41, and the annular inner side of the bottom wall 2 41 is provided with a thread 2 43; A neck for conne...

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PUM

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Abstract

The invention discloses a heat dissipation shell of a thin film capacitor. The heat dissipation shell comprises a cylindrical body part for containing a thin film core, a cylindrical head for fixing a leading-out terminal and a neck for connecting the body part with the head; wherein the body part is provided with a first round bottom wall and a first tubular side wall, and the edge of the first bottom wall is connected with the lower end of the first side wall; the head is provided with a second annular bottom wall and a second tubular side wall, and the lower end of the second side wall is connected with the annular outer side edge of the second bottom wall; the neck is provided with a third annular bottom wall and a third tubular side wall, the lower end of the third side wall is coaxially connected with the third bottom wall, and the outer diameter of the third side wall is smaller than the annular outer diameter of the third bottom wall. The heat dissipation shell of the thin film capacitor has good heat dissipation performance, the whole structure is convenient to assemble, welding operation is not needed, all the components are of a sheet-shaped and cylindrical combined structure, and therefore the heat dissipation shell is easy to machine.

Description

technical field [0001] The invention relates to a heat dissipation shell of a film capacitor, which belongs to the technical field of film capacitor production and manufacture. Background technique [0002] The film capacitors in the prior art have high failure rate, unstable performance and short service life due to insufficient heat dissipation performance. The reason is that the film capacitor has a certain heating power, and the film thermal conductivity of the film capacitor is relatively poor, which leads to serious heating of the film capacitor. If the film capacitor works in a high temperature range for a long time, the performance cannot be guaranteed, and the thermal shock is increased. wear failure rate. In the prior art, in order to improve the working stability of the film capacitor and prolong the service life of the film capacitor, the method of increasing the volume of the film capacitor to increase the equivalent area is mainly used to reduce the thermal re...

Claims

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Application Information

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IPC IPC(8): H01G4/224H01G4/002H01G4/33
Inventor 汪秀义
Owner TONGLING YUANFENG ELECTRONICS
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