Lamination ceramic substrate breaking method

A technology of ceramic substrates and laminated ceramics, applied in multilayer circuit manufacturing, fine working devices, stone processing equipment, etc., can solve problems such as difficulty in breaking, inability to produce vertical cracks, inability to complete separation, etc.

Active Publication Date: 2014-03-26
MITSUBOSHI DIAMOND IND CO LTD
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0004] In the aforementioned Patent Document 1, there is a problem that scribing must be performed before laminating the metal thin film on the ceramic substrate, and it is not necessary to divide the laminated ceramic substrate that has already been laminated.
Next, if figure 2 As shown in (c), even if the laminated ceramic substrate is to be broken using the breaking bar 104, vertical cracks cannot be generated on the ceramic substrate 101 side unless sufficient vertical cracks are formed in the metal film 102.
Therefore, there are difficulties in performing fragmentation and separation cannot be completed, or if figure 2 Problems shown in (d) that cannot be separated along the scored line
[0007] It can be seen that the above-mentioned existing breaking method obviously still has inconvenience and defects in use, and needs to be further improved urgently.

Method used

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  • Lamination ceramic substrate breaking method
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  • Lamination ceramic substrate breaking method

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Embodiment Construction

[0020] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation and structure of a cutting method for a laminated ceramic substrate proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , features and their effects are described in detail below.

[0021] image 3 (a) shows a laminated ceramic substrate (hereinafter referred to simply as a laminated substrate) 10 to be divided, in which a metal film 12 is applied to a ceramic substrate 11 . Here, the ceramic substrate 11 can also be an LTCC (Low Temperature Co-fired Multilayer Ceramic; Low Temperature Co-fired Ceramic) substrate, or aluminum oxide (alumina) or aluminum nitride (aluminum nitride), barium titanate (barium titanate) ), silicon nitride (silicone nitride) and other ceramic substrates. In addition, the metal film 12 is a thin...

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Abstract

The invention provides a lamination ceramic substrate breaking method for breaking the lamination ceramic substrate with a metal film. A first etching line (S1) is formed on the ceramic substrate (11) of the lamination ceramic substrate (10) along a breaking predetermined line. Then a second etching line (S2) is formed on a side of the metal film (12) in the same position of the first etching line (S1) by the etching device. Further, the lamination ceramic substrate is broke along the first etching line (S1) and the second etching line (S2) along a face on the side of the ceramic substrate (11) and a face on the side of the metal film (12). Therefore, the lamination ceramic substrate (10) can be disconnected completely.

Description

technical field [0001] The present invention relates to a breaking method of a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate. Background technique [0002] Conventionally, when dividing a laminated ceramic substrate in which a metal film is laminated on a ceramic substrate, the division is often performed using a dicing saw or the like. In addition, Patent Document 1 mentions a method of manufacturing a ceramic bonded substrate in which a metal layer is bonded after scribing a ceramic substrate, and the metal layer on the scribed line is removed by etching and then fractured. [0003] Patent Document 1: Japanese Patent Laid-Open No. 2009-252971 [0004] In the aforementioned Patent Document 1, there is a problem that scribing must be performed before laminating the metal thin film on the ceramic substrate, and the laminated ceramic substrate that has already been laminated is not divided. [0005] In addition, in order to break the l...

Claims

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Application Information

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IPC IPC(8): H01L21/304B28D5/00H05K3/46
CPCB28D1/00H01L21/4846B28D5/04C03B33/023C03B33/033C03B33/07Y02P40/57
Inventor 武田真和村上健二
Owner MITSUBOSHI DIAMOND IND CO LTD
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