Lamination ceramic substrate breaking method
A technology of ceramic substrates and laminated ceramics, applied in multilayer circuit manufacturing, fine working devices, stone processing equipment, etc., can solve problems such as difficulty in breaking, inability to produce vertical cracks, inability to complete separation, etc.
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[0020] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation and structure of a cutting method for a laminated ceramic substrate proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. , features and their effects are described in detail below.
[0021] image 3 (a) shows a laminated ceramic substrate (hereinafter referred to simply as a laminated substrate) 10 to be divided, in which a metal film 12 is applied to a ceramic substrate 11 . Here, the ceramic substrate 11 can also be an LTCC (Low Temperature Co-fired Multilayer Ceramic; Low Temperature Co-fired Ceramic) substrate, or aluminum oxide (alumina) or aluminum nitride (aluminum nitride), barium titanate (barium titanate) ), silicon nitride (silicone nitride) and other ceramic substrates. In addition, the metal film 12 is a thin...
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