A kind of processing method of LED encapsulation cup body and corresponding mold

Abstract

The invention discloses an LED packaging cup body processing method and a corresponding die. The method comprises the steps of manufacturing a die (1), placing a flexible substrate (5) on the bottom face of an inner cavity (9), injecting liquid into the inner cavity through a liquid injecting hole (4), sealing the inner cavity, applying pressure into the inner cavity (9) so as to enable a cup body matched with a groove (2) in shape to be formed on the flexible substrate (5), taking out the flexible substrate (5), and discharging liquid. The die (1) comprises a base (7) and a cover piece (8). The base (7) and the cover piece (8) are tightly matched with each other to form the inner cavity (9). One or more grooves (2) are formed in the bottom face of the inner cavity (9). The liquid injection hole (4) is formed in the cover piece (8). The LED packaging cup body has the advantages of being low in cost, high in efficiency, incapable of damaging the flexible substrate, good in evenness, and suitable of volume production.

Description

technical field [0001] The invention relates to the field of LED lighting, in particular to a method for processing an LED packaging cup and a corresponding mold. Background technique [0002] The flexible substrate is a printed circuit made of flexible insulating substrates, and the design and production of circuit graphics on the flexible substrate has many advantages that rigid printed circuit boards do not have. Soft substrate products are small in size and light in weight, greatly reducing the volume of devices, and are suitable for the development of electronic products in the direction of high density, miniaturization, light weight, thinning, and high reliability. It is highly flexible and can be freely bent, wound, twisted and folded. It can be wired three-dimensionally. It can be arranged and changed in shape according to the requirements of space layout, and can be moved and stretched freely in three-dimensional space, so as to achieve component assembly and wire c...

AI Technical Summary

Problems solved by technology

Metal molds are generally used to impact and extrude the cup body on the flexible substrate. However, during the processing, the mold and the surface of the substrate will contact and rub, which will cause the light reflection layer on the surface of the flexible substrate to be scratched, peeled off, etc., which not only affects the reflection effect , and the residue will pollute the chip welding surface on the substrate, affecting the contact and welding between the LED chip and the substrate welding surface, so it is necessary to provide a low-cost, high-efficiency, zero-damage method for processing reflective cups on flexible substrates

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