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Negative pressure water cooling system, negative pressure monitoring device and negative pressure monitoring method

A water-cooling system and monitoring device technology, which is applied in cooling/ventilation/heating transformation, by measuring the increase and deceleration rate of fluid, instruments, etc., can solve problems affecting liquid flow, residual air in pipelines, coolant leakage, etc.

Active Publication Date: 2017-09-19
GIGA BYTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in the above-mentioned known water-cooling system, due to the phenomenon that the pipeline is too large or there is air remaining in the pipeline, etc., it is easy to cause the flow resistance of the coolant to change and affect the liquid flow.
In addition, it is known that the gas pressure in the water cooling system is mostly the ambient air pressure, which is the same as the external air pressure of the water cooling system. If the pipeline is damaged, it is easy to cause the problem of coolant leakage

Method used

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  • Negative pressure water cooling system, negative pressure monitoring device and negative pressure monitoring method
  • Negative pressure water cooling system, negative pressure monitoring device and negative pressure monitoring method
  • Negative pressure water cooling system, negative pressure monitoring device and negative pressure monitoring method

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Embodiment Construction

[0061] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. The same symbols represent components or devices with the same or similar functions.

[0062] first please refer to Figure 1 to Figure 3 . figure 1 It is a schematic diagram of the negative pressure water cooling system of the first embodiment of the present invention. figure 2 is a block diagram of the first embodiment of the monitoring device of the present invention. image 3 is based on figure 2 Flowchart of the monitoring method.

[0063] Please refer to figure 1 . The negative pressure water cooling system of the first embodiment has a water cooling assembly 2 , a negative pressure device 10 and a monitoring device 11 .

[0064] Such as figure 1 As shown, the water cooling assembly 2 has a coolant tank 12 , a pipeline 14 , a pump part 16 and a heat sink.

[0065] The coolant tank 12 has a first opening 121 , a second opening 12...

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Abstract

The invention relates to a negative pressure water cooling system comprising a negative pressure monitoring device, thereby implementing a negative pressure monitoring method. The negative pressure water cooling system pumps a coolant for circulation, which includes a coolant tank, a pump part, and a heat sink. The coolant tank has a first opening, a second opening and a third opening. The first opening and the third opening are located below the liquid surface of the cooling liquid. The second opening is located on the liquid surface of the coolant. The pump element pumps the coolant in the coolant tank through the first opening. The cooling element is connected to the pump element for the coolant to exchange heat through the cooling element. The negative pressure device is connected to the third opening, thereby forming a passage with the coolant tank. The monitoring device includes a control unit electrically connected with the negative pressure device. The control unit stores a preset time value. When the operation time of the negative pressure water cooling system meets the preset time value, the control unit sends a control signal to make the negative pressure device start to draw the gas in the passage, so that the air pressure in the passage is lower than that outside the passage. air pressure value.

Description

【Technical field】 [0001] The invention relates to a water cooling system for electronic devices, in particular to a negative pressure water cooling system for electronic devices. 【Background technique】 [0002] The development of electronic products tends to be integrated and miniaturized, resulting in doubled heat output per unit area of ​​electronic devices such as central processing units or chips. How to control the problems caused by a large amount of heat output, such as affecting the running speed of the product, noise, etc., is an important issue. Therefore, electronic products need a heat sink that can ensure sufficient cooling capacity in a narrow area, so that the operating temperature of each electronic component in the electronic device can be kept within a reasonable range to promote heat exchange between it and the environment, thereby protecting Electronic components, to avoid damage to electronic components or computer system crashes due to overheating. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20H05K7/20G01M3/26
Inventor 毛黛娟黄顺治
Owner GIGA BYTE TECH CO LTD