A box-type heat preservation/radiation device for blade servers

Abstract

A box-type heat preservation / radiation device for blade servers adopts the structure of an inner and outer box, the inner box is a carrying box for electrical components, and the outer box is a heat preservation / radiation box. The upper and lower planes of the outer box of the device are air duct insulation / heat transfer surfaces, and the rest are heat insulation surfaces. The heat dissipation and heat preservation of the chassis are controlled by controlling the on-off of the air flow in the upper and lower heat transfer air ducts. Mounting the finished radiator increases the heating surface of the outer box to improve heat dissipation efficiency; the heating chip in the inner box adopts a dual-path heat transfer method of upward convection and downward conduction to reduce heat flux density and improve heat transfer efficiency; The clutch of the tapered pin hole realizes separation and fastening. The device uses economical and safe natural air as the heat transfer medium, and realizes safe, energy-saving and compact heat preservation / radiation functions through structural design without relying on refrigeration facilities.

Description

technical field [0001] The invention relates to the technical field of electronic heat dissipation, in particular to a box-type heat preservation / radiation device for blade servers. Background technique [0002] The blade server is characterized by a large planar size and a small thickness. Since the blade server has powerful data processing and storage capabilities, its heat consumption is correspondingly large. Commercial servers usually use forced air cooling through the front and back, but this method cannot be used in harsh environments. When the environmental conditions are humid or contain corrosive substances such as mold and salt spray, a closed structure must be used to separate the circuit board from the harsh environment. Environmental isolation, but this makes heat dissipation difficult. In this case, in order to obtain a good heat dissipation effect, when the power dissipation of the equipment is too large, the industry usually considers the use of water cooli...

AI Technical Summary

Problems solved by technology

Commercial servers usually use forced air cooling through the front and back, but this method cannot be used in harsh environments. When the environmental conditions are humid or contain corrosive substances such as mold and salt spray, a closed structure must be used to separate the circuit board from the harsh environment. Environmental isolation, but this makes heat dissipation difficult

In this case, in order to obtain a good heat dissipation effect, when the power dissipation of the equipment is too large, the industry usually considers the use of water cooling to solve the heat dissipation problem, but the water cooling method is limited by external conditions, such as: there must be a water source If you use self-circulating water, you have to bring your own water tank pump, water pipeline, cooling device, etc. For some small and medium-sized servers, it is difficult to implement

Moreover, there is a hidden danger of water leakage in water cooling, and its safety needs to be considered

[0003] In addition, the storage device in the server is not suitable for low temperature operation, so preheating measures are required, but heating and heat dissipation are often contradictory, because usually good heat preservation effect means poor heat dissipation effect

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