LED (Light-Emitting Diode) based on COB (Chip On Board) package and manufacturing method thereof
A technology of LED light source and manufacturing method, which is applied to electrical components, electric solid-state devices, circuits, etc., can solve the problems of chip breakage, low blue light extraction efficiency, difficult light source and large light extraction angle, etc., so as to avoid breakage and improve light extraction efficiency. Effect
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[0056] The preparation method of the LED blue light source of the present invention is as follows: fixing the LED chip on a ceramic or metal heat-conducting substrate; then coating the surface of the chip with low-stress encapsulating transparent silica gel, and then attaching the silica gel lens to the surface of the encapsulating silica gel, While encapsulating the chip, it is co-cured with transparent packaging silica gel, so that the silica gel lens is combined on the top of the chip; another way is to directly cure and package the LED chip through low-stress packaging silica gel to protect the chip, and then seal it on the surface of the packaging silica gel. Coat a layer of liquid silica gel, and then stick the lens on the surface of the liquid silica gel for thermal curing, so that the silica gel lens and the chip are combined to form an LED blue light source, which is characterized in that the LED blue light source has higher stability and ease of use. Processability. ...
Embodiment 1
[0068] Figure 2a to Figure 2c It is a schematic diagram of a blue light source combined with a silica gel lens 21, such as Figure 2a As shown, the LED chip 13 is directly fixed on the heat sink 11, and is encapsulated by a layer of silica gel to form a silica gel package body 12, and a silica gel lens 21 is bonded on the surface of the silica gel to form an LED blue light source.
[0069] Specifically, a plurality of LED chips 13 are directly pasted on the heat sink substrate 11, and then a layer of transparent silica gel is covered on the LED chips by encapsulating silica gel, and the encapsulation surface is formed by heat curing, and the surface of the encapsulation surface is coated with a layer of adhesive; At the same time, an independent hemispherical silicone lens 21 is obtained by injection molding, and the lens is pasted on the packaging surface, cured and molded to obtain Figure 2a Blue light source shown.
[0070] Figure 2b It is another embodiment of the bl...
Embodiment 2
[0077] Figure 3a It is a white light source composed of a COB light source combined with a remote fluorescent lens, such as Figure 3a As shown, the remote phosphor device 22 of hemispherical structure is directly fixed on the COB light source, and there is an air gap 23 between the remote phosphor device 22 and the light source. Because the blue light extraction efficiency of the traditional COB light source is relatively low, the effective blue light that excites the remote phosphor device is reduced, thereby reducing the output of white light.
[0078] The schematic diagram of the structure of the white light source of the present invention is as follows: Figure 3b As shown, the double-layer composite silicone lens is attached to the surface of a traditional COB blue light source to form a white light source. The preparation method of the light source is as follows Figure 6 As shown, its specific implementation steps are as follows:
[0079] Step 1: Add fluorescent po...
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