Glass filler strip
A technology of glass strips and gaskets, applied in crystal growth, post-processing details, post-processing, etc., can solve problems such as high pressure and reduced cutting yield, and achieve the effects of improving yield, reducing bright edges, and improving processing quality
Inactive Publication Date: 2014-04-09
JIANGSU MEIKE SILICON ENERGY
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Problems solved by technology
[0005] Using conventional flat glass spacers, during the bonding process, the resin adhesive layer has a phenomenon of gas pressure during bonding. With the fusion of the resin adhesive layer, the air bubbles are turned upwards, and most of them will be transferred to silicon. On the lower surface of the ingot, the pressure in the air bubbles is extremely high. During the slicing process, the high-pressure air bubbles will cause silicon drop and bright edges on the adhesive surface, resulting in a decrease in the cutting yield.
Method used
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[0010] The present invention will be further described below by specific examples.
[0011] As shown in the figure, the glass spacer of the present invention includes a glass strip body 1, and a groove 2 is provided on the bonding surface of the glass strip body.
[0012] Preferably, there are four grooves, and the distance 3 between the grooves is equal and twice the distance 4 outside the grooves.
[0013] Preferably, neither the groove depth nor the groove width of the groove exceeds 3mm.
[0014] In the present invention, the conventional glass is slotted, the number of slots is 4, and the slotting position is divided equally on the entire plane of the glass, specifically, the spacing inside the slot is equal, and the sum of the spacing on both sides outside the slot is equal to the spacing inside the slot. The groove width and depth of the grooved glass are controlled within 3mm*3mm.
[0015] When using the glass bead of the present invention, the glue coating step is t...
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The invention provides a glass filler strip and belongs to the technical field of photovoltaic silicon ingot bonding. The glass filler strip comprises a glass strip body. A bonding surface of the glass strip body is provided with a groove. In use of the glass filler strip, a gluing step is the same as that of the conventional glass filler strip and comprises the following steps of coating the bonding surface having the groove with a glue layer, removing resin glue in the groove by a special-purpose tool, carrying out silicon ingot bonding and pressing a pressing block so that under the action of the silicon ingot and the pressing block on the glue layer, the redundant glue layer flows into the groove to carry bubbles out of the groove and thus bright sides and falling silicon produced in the silicon ingot glue surface cutting are reduced and a silicon chip cutting yield and silicon chip processing quality are improved.
Description
[0001] technical field [0002] The invention belongs to the technical field of photovoltaic silicon ingot bonding, and in particular relates to a glass gasket used for bonding silicon ingots. Background technique [0003] In the silicon ingot slicing process, silicon ingot bonding is a key process before silicon material cutting and processing. Silicon ingot bonding usually uses resin glue to bond glass pads and silicon ingots together, and then slices the silicon ingots. [0004] In the field of silicon ingot bonding technology, how to make the resin glue bonded firmly without air bubbles in the glue layer, so as to reduce the defects such as silicon falling and bright edges on the glue layer produced by slicing, has become an important topic in the bonding field. . At present, the glue layer is usually applied on the plane glass, or the method of coating the glue layer on the surface of the plane glass and the silicon ingot at the same time, and then the method of bondin...
Claims
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Inventor 陈建王禄堡
Owner JIANGSU MEIKE SILICON ENERGY