Preparation method of adhesive for wafer cutting

A technology for adhesives and wafers, applied in the direction of adhesives, adhesive types, conjugated diene adhesives, etc., can solve the problems of high chip drop rate, bright edges, high defective rate, etc., to improve the rate of excellent products, Easy degumming, good toughness effect

Inactive Publication Date: 2015-04-08
杨大华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing adhesives have problems such as high chip loss rate, many bright edges, and high defective rate.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0030] A preparation method of adhesive for wafer cutting, the preparation method is as follows:

[0031] (1) To prepare component A, mix 90 parts of epoxy resin, 45 parts of polyvinyl alcohol resin, 16 parts of sodium bisulfite, 12 parts of precipitated barium sulfate, 2 parts of acrylic acid, 4 parts of ethanol, and 3 parts of epoxy octyl stearate Add one part into the reaction kettle and stir, the stirring temperature is 110°C, and the stirring time is 2h, and component A can be obtained;

[0032] (2) To prepare component B, add 45 parts of nitrile rubber, 2 parts of plasticizer and 0.5 part of coupling agent into the reactor and stir evenly at high speed, then add 11.25 parts of butyl acrylate, start stirring at the same time and heat up to 120°C, keep warm for 2 hours to complete the reaction to obtain component B;

[0033] (3) Weigh component A and component B according to the weight ratio of 25:17, mix well, and then evenly scrape and coat the crystal rod and the surfa...

example 2

[0036] A preparation method of adhesive for wafer cutting, the preparation method is as follows:

[0037] (1) Preparation of component A, 100 parts of epoxy resin, 50 parts of polyvinyl alcohol resin, 19 parts of sodium bisulfite, 20 parts of precipitated barium sulfate, 4 parts of acrylic acid, 8 parts of ethanol, 6 parts of epoxy octyl stearate Add it into the reaction kettle and stir, the stirring temperature is 110°C, and the stirring time is 3h, and component A can be obtained;

[0038] (2) To prepare component B, add 50 parts of nitrile rubber, 3 parts of plasticizer and 1 part of coupling agent into the reaction kettle and stir evenly at high speed, then add 12.5 parts of butyl acrylate, start stirring at the same time and heat up to 110°C, keep warm for 2 hours to complete the reaction to obtain component B;

[0039] (3) Weigh component A and component B according to the weight ratio of 31:22, mix well, and then evenly scrape and coat the crystal bar and the surface o...

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PUM

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Abstract

The invention relates to a preparation method of an adhesive for wafer cutting. The preparation method comprises the following steps of: (1) preparing a component A; (2) preparing a component B; (3) weighing the component A and the component B in parts by weight, sufficiently and uniformly mixing, then uniformly carrying out knife coating on the surfaces of a crystal bar and a glass plate, tightly pressing and fixing on the glass plate, standing for 1 hour, then moving the crystal bar, sufficiently solidifying for 4 hours, and then cutting on a machine to obtain a finished product. The adhesive has the characteristics of easiness for debonding, high hardness, good toughness and the like, is suitable for the cutting of a wafer and can be used for reducing the wafer drop and edge brightening and enhancing the superior product rate.

Description

technical field [0001] The invention relates to an adhesive for wafer cutting. Background technique [0002] During the cutting process of semiconductor wafers, due to various reasons, complete ingots may fall off or part of the wafers may be broken, bright edges, etc. However, better quality wafers can be obtained by coating with adhesive followed by dicing followed by debonding and cleaning. However, the existing adhesives have problems such as high chip loss rate, many bright edges, and high defective rate. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a preparation method of an adhesive for wafer cutting, which is easy to degumming, has the characteristics of high hardness and good toughness, and is suitable for cutting thinner wafers, while reducing chip loss and improving bright edges. Excellent product rate. [0004] In order to solve the problems of the technologies described above, the technical sol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J129/04C09J109/02C09J11/04C09J11/06C09J11/08
Inventor 聂金根
Owner 杨大华
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