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Vibrator, manufacturing method of vibrator, electronic apparatus, and mobile unit

A manufacturing method and vibrator technology, which can be used in electrostatic motors, microelectronic microstructure devices, electrical components, etc., can solve the problems of upper electrodes sticking to lower electrodes, etc.

Inactive Publication Date: 2014-04-16
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is, in the prior art, the problem of the upper electrode sticking to the lower electrode in the manufacturing process will be significantly manifested when dealing with the above-mentioned needs

Method used

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  • Vibrator, manufacturing method of vibrator, electronic apparatus, and mobile unit
  • Vibrator, manufacturing method of vibrator, electronic apparatus, and mobile unit
  • Vibrator, manufacturing method of vibrator, electronic apparatus, and mobile unit

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Experimental program
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Effect test

no. 1 Embodiment approach )

[0059] figure 1 (a) is a side sectional view showing the MEMS vibrator 100 as the vibrator of the first embodiment, figure 1 (b) is a perspective view showing the MEMS vibrator 100 as the vibrator of the first embodiment. figure 1 (a) shows figure 1 (b) A-A' section. The MEMS vibrator 100 is a MEMS vibrator provided with a double-ended free beam-type movable electrode formed by etching a sacrificial layer laminated on a main surface of a substrate. The MEMS vibrator 100 is configured to include a wafer substrate 110, a fixed lower electrode 120 as a first electrode, a movable upper electrode 130 as a second electrode, a support member 140, and the like. In addition, the term "sacrifice layer" refers to a layer that is removed by etching after forming desired layers above, below, and around it. By removing the sacrifice layer, a desired gap or cavity is formed between the layers above, below, and around, Alternatively, the desired construct can be formed freely.

[0060] A...

no. 2 Embodiment approach )

[0081] use Figure 4 to Figure 13 The vibrator of the second embodiment will be described. Figure 4 It is a perspective view schematically showing a MEMS vibrator as a vibrator of this embodiment. Figure 5 is schematically shown Figure 4 A cross-sectional view of a section C-C′ of the MEMS vibrator 200 shown. Figure 6 is schematically shown Figure 4 A cross-sectional view of a D-D' section of the MEMS vibrator 200 shown. Figure 7 is shown schematically with hatching Figure 4 A perspective view of a cross-section of the E-E' portion of the supporting member of the MEMS vibrator 200 shown. Figure 8 ~ Figure 13 It is a process drawing explaining the manufacturing method of the MEMS vibrator 200 which is a vibrator of this embodiment.

[0082] A MEMS vibrator 200 as a vibrator according to the second embodiment includes a movable upper electrode 230 , a support member 240 extending from the movable upper electrode 230 , and a fixing portion 250 fixing the support mem...

no. 3 Embodiment approach )

[0112] As a third embodiment, according to Figure 14 (a), (b), Figure 15 An electronic device to which the MEMS vibrator 100 of the first embodiment or the MEMS vibrator 200 of the second embodiment, which are electronic components according to an embodiment of the present invention, will be described.

[0113] Figure 14 (a) is a perspective view showing a schematic configuration of a mobile (or notebook) personal computer as an electronic device having an electronic component according to an embodiment of the present invention. In this figure, a personal computer 1100 is composed of a main body 1102 having a keyboard 1101 and a display unit 1104 having a display 1103 , and the display unit 1104 is rotatably supported by the main body 1102 via a hinge structure. Such a personal computer 1100 incorporates the MEMS vibrator 100 or the MEMS vibrator 200 as an electronic component that functions as a filter, a resonator, a reference clock, or the like.

[0114] Figure 14 (...

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Abstract

A vibrator, a manufacturing method of the vibrator, an electronic apparatus, and a mobile unit. The invention provides a vibrator which can be manufactured stably without adhesion of movable electrodes in manufacture procedures. The MEMS vibrator (100) includes a wafer substrate (110), a fixed lower electrode (120) (first electrode) disposed on a principal surface of the wafer substrate (110), a support member (140) whose one end is fixed to the wafer substrate (110), and a movable upper electrode (130) (second electrode) joined to the other end of the support member (140) and having a region overlapping the fixed lower electrode (120) with a gap. The support member (140) has a reinforcing region (140s) where the thickness of the support member (140) in a thickness direction of the wafer substrate (110) is larger than the thickness of the movable upper electrode (130) in the thickness direction of the wafer substrate (110).

Description

technical field [0001] The present invention relates to a vibrator, a method for manufacturing the vibrator, electronic equipment, and a mobile body. Background technique [0002] Electromechanical structures (for example, vibrators, filters, sensors, motors, etc.) called MEMS (Micro Electro Mechanical System: microelectromechanical systems) devices formed by microfabrication technology are generally known. The body has a mechanically movable structure. Among them, compared with vibrators / resonators using quartz or dielectrics that have been mainly used so far, MEMS vibrators are easy to mount and manufacture with semiconductor circuits, which is beneficial to miniaturization and high functionality, so they are actively used. . [0003] As typical examples of conventional MEMS vibrators, there are known a comb-type vibrator vibrating in a direction parallel to a substrate surface and a beam-type vibrator vibrating in a thickness direction of a substrate. A beam-type vibra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/125H03H9/02H03H3/02
CPCH02N1/006B81B3/0013B81B2201/0271H03H3/0072H03H9/02338H03H9/2452H03H2009/02291H03H2009/02472Y10T29/49124
Inventor 稻叶正吾藤井正宽
Owner SEIKO EPSON CORP