Conductive pattern, method for forming the same, printed wiring board, and manufacturing method of the same
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- FUJIFILM CORP
- Publication Date
- 2014-04-16
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The present invention relates to a method of forming a conductive pattern using inkjet system technology, the conductive pattern has excellent manufacturing adaptability and high adhesion and conductivity, and wherein the conductive pattern forming an image does not change until it is dried; A method of manufacturing a printed circuit board using the forming method; and a printed circuit board manufactured by the manufacturing method. Background technique
[0002] Metal materials such as gold, silver, copper, platinum, aluminum, palladium, and nickel have long been used as materials constituting electrical components. First, because copper or silver materials are inexpensive, highly versatile, and highly conductive materials, they are widely used even now as materials for ensuring electrical continuity, such as circuit-forming parts of printed circuit boards, various Electrical contact parts and external electrode parts (such as capacitors, etc.). ...