Encapsulation structure and preparation method thereof

Abstract

The invention provides a packaging structure and a preparation method thereof. A lead frame comprises a plurality of pins; one surface of each pin which is used for electrically connecting a chip is a top surface, the surface opposite to the top surface is a bottom surface, side faces between the top surface and the bottom surface are two opposite first side faces and two opposite second side faces, and the first side faces are longer and narrower than the second side faces; at least one section is formed between the top surface and the bottom surface, the width of the top surface is a first width, the width of the section is a second width, the second width is smaller than the first width, and the width of the top surface is a distance between the two first side faces on the top surface; the width of the section is a distance between the two first side faces on the section, so that the contact area of the side faces of each pin and a molding compound is increased, the molding compound is locked and is difficult to break, breakage paths of the molding compound or paths for vapor and other pollutants to enter internal devices are increased, and the packaging reliability is improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, in particular to a package structure and a preparation method thereof. Background technique [0002] The lead frame used in integrated circuit plastic packaging is a main structural material of integrated circuit packaging. It mainly plays the role of carrying the chip in the integrated circuit packaging structure, and at the same time plays the role of connecting the chip and the electrical signal of the external circuit board. [0003] Specifically, please refer to Figure 1 ~ Figure 3 ,in, figure 1 is a three-dimensional schematic diagram of an existing packaging structure; figure 2 for figure 1 AA' sectional view of the package structure shown; image 3 for figure 1 The BB' cross-section of the package structure shown. [0004] Such as figure 1 As shown, the existing packaging structure 1 includes a lead frame 10 , a chip 11 and an electrical connector 12 ...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a packaging structure and its preparation method to solve the problem that the existing packaging structure is likely to cause the plastic sealant to break, so that external water vapor or other pollutants enter the packaging structure and cause damage to the internal components; and the existing The packaging structure is not conducive to increasing the path of mold compound rupture or the path of water vapor and other pollutants entering internal components, which affects the reliability of the packaging structure

Images