Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Polishing pad

A technique for polishing pads and light-transmitting areas, which is applied in the field of polishing pads to achieve the effects of shortening the distance, preventing the reduction of light transmittance, and improving the accuracy of optical detection

Inactive Publication Date: 2014-04-23
TOYO TIRE & RUBBER CO LTD
View PDF11 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if there is a transparent support film under the light-transmitting area, the same problem as described will occur

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polishing pad
  • Polishing pad
  • Polishing pad

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0045] There is no special limitation on the preparation method of the light-transmitting region 9, which can be prepared by known methods. For example, a method of cutting the urethane resin block prepared by the above method into a specified thickness with a slicer of a band saw type or a planer type, a method of injecting the resin into a mold having a cavity of a specified thickness and curing it, injection Mold forming method, method using coating technology or sheet forming technology.

[0046] One side of the light-transmitting region 9 has a peripheral portion 13 and a recessed portion 14 . There is no particular limitation on the method of forming the depressed portion 14, for example, the method of forming by cutting the surface of the light-transmitting region prepared by the above-mentioned method, directly preparing the transparent portion with the depressed portion by injection molding method or casting molding method. method of light area, etc.

[0047] There ...

example 1

[0092] The polishing area 8 and the buffer layer 11 are adhered, and then, the opening 10 penetrating the polishing area 8 and the buffer layer 11 is formed. After that, the support film 12 is bonded to one surface of the buffer layer 11 . Next, the light-transmitting region 9 is embedded in the opening 10 , and the peripheral portion 13 of the light-transmitting region 9 is bonded to the support film 12 . In addition, the portion of the supporting film 12 corresponding to the recessed portion 14 of the light-transmitting region 9 is cut away to open the recessed portion 14 .

example 2

[0094] The polishing area 8 and the buffer layer 11 are adhered, and then, the opening 10 penetrating the polishing area 8 and the buffer layer 11 is formed. After that, the support film 12 is bonded to one surface of the buffer layer 11 . Next, a translucent resin composition is poured into the opening 10 and on the support film 12 , heated, and hardened by light irradiation or moisture to form the translucent region 9 . In addition, the supporting film 12 is cut at a portion corresponding to the depressed portion 14 of the light-transmitting region 9 , and the depressed portion 14 is formed by cutting or the like.

[0095] Such as image 3 As shown, the covering member 15 may be provided on the side surface of the recessed portion 14 . There are no particular limitations on the method of providing the covering member 15, and examples include a method of bonding a resin sheet, a method of applying a resin composition or an adhesive to the side of a recessed portion and curi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention addresses the problem of providing a polishing pad capable of preventing slurry leakage while having excellent optical detection precision. This polishing pad is characterized in that a polishing area, a cushion layer, and a support film are layered in the stated order, and an optically transparent region is provided on the support film, in an aperture that passes through the polishing area and cushion layer. The optically transparent area has a peripheral part and a recessed part in the polishing table-side surface. The support film is layered on the peripheral part, but the support film is not layered on the recessed part, which remains open.

Description

technical field [0001] The present invention relates to a polishing pad used when flattening unevenness on the surface of a semiconductor wafer or the like to be polished by chemical mechanical polishing (CMP), and more particularly to a polishing pad having a window (light-transmitting region) for optically detecting polishing conditions, etc. A polishing pad and a method for preparing a semiconductor device using the polishing pad. Background technique [0002] When manufacturing a semiconductor device, a step of forming a conductive film on the surface of a semiconductor wafer (hereinafter referred to as a wafer), forming a wiring layer by photolithography, etching, etc., and a step of forming an interlayer insulating film on the wiring layer, etc., are carried out through these The step produces bumps on the surface of the crystal that are composed of conductors such as metals or insulators. In recent years, in order to achieve higher densities of semiconductor integrat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/22B24B37/013H01L21/304
CPCH01L21/304B24B37/205B24B37/22
Inventor 木村毅
Owner TOYO TIRE & RUBBER CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com