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A kind of polishing pad and preparation method thereof

A polishing pad, polyurethane vinyl technology, applied in the field of sapphire polishing, can solve the problems of single manufacturer, scattered flying, difficult to stir and operate, etc.

Inactive Publication Date: 2016-04-27
HUBEI DINGHUI MICROELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the specific gravity of this substance is very light. Once the package is opened, it is easy to scatter and fly in the process of adding. When operating, it is necessary to wear protective glasses, protective gloves, protective masks and other protective tools, and it is not easy to stir.
In addition, the manufacturer of this substance is single and must rely on foreign imports

Method used

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  • A kind of polishing pad and preparation method thereof
  • A kind of polishing pad and preparation method thereof
  • A kind of polishing pad and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0043] A preparation method of a polishing pad, comprising the following steps,

[0044] 1) Heat the prepolymer reactant to 75°C, heat the MOCA to 115°C, and then perform gelation at a temperature of 75°C to 115°C, and the gelation time is about 5 to 15 minutes, wherein the prepolymerization The weight ratio of the body reactant to the MOCA is 3.58:1;

[0045] 2) Add ultra-short polyester fibers or ultra-short aramid fibers with a weight percentage of 1% to 8% to the prepolymer reactant, and use a stirring box to mix the prepolymer reactant with the MOCA is fully stirred and mixed to obtain mixture A;

[0046] 3) Put the mixture A into a centrifuge at 92°C to 110°C for high-temperature gelation, and gel for 30 minutes to 90 minutes to obtain a gelled polyurethane sheet;

[0047] 4) Transfer the gelled polyurethane sheet obtained in step 3) to a vulcanization oven, and vulcanize at a temperature of 100°C-120°C for 10-17 hours to obtain a vulcanized polyurethane sheet;

[004...

Embodiment 1

[0053] Embodiment 1 is in the test data and the result of oxide layer polishing

[0054] 1. Polishing machine parameter setting

[0055]

[0056]

[0057] Polishing result:

[0058]

[0059] Polishing rate and polishing flat rate:

[0060]

[0061] From the above test results and image 3 It can be seen that the overall polishing rate of polyurethane polishing pads added with polyester can be improved by fine-tuning the polishing pressure, and the polishing flat rate is very stable at about 2%. There is a substantial reduction. In chemical mechanical polishing, the lower the global polishing flat rate, the better the overall polishing effect and the higher the chip yield.

Embodiment 2

[0062] Embodiment 2 is at the test data and the result of metal layer polishing

[0063] Polishing result:

[0064]

[0065]

[0066] Polishing rate and polishing flat rate:

[0067]

[0068] From the above test results and Figure 4 It can be seen that no matter how the polishing test parameters are adjusted, the polyurethane polishing pads added with 0.5% to 7% polyester fiber powder always show excellent and very stable global flatness when the grinding rate increases or decreases with the change of polishing parameters. Rate (NU%). And the polishing life is greatly increased.

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Abstract

A polishing pad and preparation method thereof, the polishing pad comprising more than two grooves (5), a polyurethane base material (1), a polyurethane fiber substrate (2), a polyurethane-ethylene adhesive PSA-A layer (3) and PSA-B layer (4); the grooves (5) are uniformly arranged on one surface of the polyurethane base material (1); the other surface of the polyurethane base material (1) adheres to one surface of the polyurethane fiber substrate (2) via the polyurethane-ethylene adhesive PSA-A layer (3); the other surface of the polyurethane fiber substrate (2) is connected to the polyurethane-ethylene adhesive PSA-B layer (4); and ultra-short polyester fiber and ultra-short aramid fiber are added to the polyurethane base material (1). The polishing pad exhibits high polishing speed, evenness and long service life in chemical mechanical polishing.

Description

technical field [0001] The invention relates to a polishing pad and a preparation method thereof, in particular to a fiber solid polyurethane-added polishing pad and a preparation method thereof, belonging to the fields of semiconductor chip precision polishing, LED substrate polishing and sapphire polishing. Background technique [0002] The semiconductor industry is the core of the modern electronics industry, and the foundation of the semiconductor industry is the silicon material industry. Although a variety of new semiconductor materials are constantly emerging, more than 90% of semiconductor devices and circuits, especially ultra-large-scale integrated circuits (ULSI), are fabricated on high-purity and high-quality silicon single crystal polished wafers and epitaxial wafers. At present, VLSI manufacturing technology has been developed to 0.25nm and 300mm era. With the further miniaturization of the characteristic line width, higher requirements are put forward for the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/24B24B37/26B24D18/00
CPCB24B37/22B24B37/26
Inventor 张莉娟
Owner HUBEI DINGHUI MICROELECTRONICS MATERIALS CO LTD