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Power supply installation structure of light-emitting diode (LED) lamp

A technology of LED lighting and installation structure, which is applied in the direction of lighting devices, parts of lighting devices, lighting and heating equipment, etc. It can solve the problems that affect the shape design of lamps, the PCB board takes up a lot of space, and the processing procedures are cumbersome. The effect of large-scale promotion and application, simplified installation process and reduced production cost

Inactive Publication Date: 2014-05-07
马少峰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 1 Due to the cumbersome processing procedures, the mass production efficiency is low;
[0006] 2. The installation structure is relatively complicated, and the number of parts is large, which increases the production cost of raw materials;
[0007] 3 The PCB board of the power supply takes up a lot of space, which affects the shape design of the lamp

Method used

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  • Power supply installation structure of light-emitting diode (LED) lamp
  • Power supply installation structure of light-emitting diode (LED) lamp
  • Power supply installation structure of light-emitting diode (LED) lamp

Examples

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Embodiment 1

[0022] Embodiment one: with reference to attached Figure 1-2 This embodiment includes a heat dissipation substrate 1, LED2, electronic components 5 and wires 4, the wires 4 are connected to the electronic components 5, the electronic components 5 are welded in the middle of the upper surface of the heat dissipation substrate 1, and the heat dissipation substrate 1 is provided with a round hole 3, Wire 4 is welded on the upper surface of heat dissipation substrate 1 through circular hole 3 from below heat dissipation substrate 1 , heat dissipation substrate 1 is arranged in a circular shape, and LEDs 2 are arranged in a ring and welded on the edge of heat dissipation substrate 1 upper surface.

[0023] The assembly process of this embodiment: first arrange the LEDs 2 in a ring and weld them on the edge of the upper surface of the heat dissipation substrate 1, and then fix the electronic components 5 in the middle of the heat dissipation substrate 1 by tin or tin-lead welding. ...

Embodiment 2

[0024] Embodiment two: with reference to attached Figure 3-5 This embodiment includes heat dissipation substrate 1, electronic components 5 and wires 4, LED package 2 includes LED chips 6, gold wires 7, cured glue 8 mixed with phosphor powder, wires 4 are connected to electronic components 5, LED chips 6, The gold wire 7 is set inside the cured glue 8, the LED chip 6 is glued on the upper surface of the heat dissipation substrate 1 and connected to the heat dissipation substrate 1 through the gold wire 7, and the electronic component 5 is welded in the middle of the upper surface of the heat dissipation substrate 1, and the heat dissipation substrate 1 A round hole 3 is provided, and the wire 4 passes through the round hole 3 from the bottom of the heat dissipation substrate 1 and is welded on the upper surface of the heat dissipation substrate 1 . at the edge.

[0025] The assembly process of this embodiment: first arrange the LED chips 6 in a ring shape and glue them on th...

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Abstract

The invention relates to the technical field of lamps, in particular to a power supply installation structure of a light-emitting diode (LED) lamp. The power supply installation structure comprises a radiating substrate, a light-emitting diode (LED), an electronic component and a wire. The LED is arranged on the upper surface of the radiating substrate, the wire is connected with the electronic component, the electronic component is welded on the upper surface or the lower surface of the radiating substrate, a round hole is formed in the radiating substrate, and the wire penetrates the round hole from the place below the radiating substrate to be welded on the upper surface of the radiating substrate. Due to the fact that the electronic component is welded on the upper surface or the lower surface of the radiating substrate, raw materials are saved, power supply installation procedures are simplified, the production efficiency is improved, the production cost is reduced, and large-range large-scale popularization and application are facilitated.

Description

[0001] technical field [0002] The invention relates to the technical field of lighting fixtures, in particular to a power supply installation structure of LED lighting fixtures. Background technique [0003] LED is the abbreviation of English light engine (light-emitting diode). LED is a semiconductor that can convert electrical energy into visible light. Long, high luminous efficiency, no radiation, low power consumption and many other advantages, with the concept of energy saving and green lighting, LEDs are gradually introduced into lighting fixtures as light sources. [0004] At present, the power supply installation structure of LED lighting fixtures is as follows: firstly, the electronic components are soldered on the PCB board, and then the PCB board is placed inside the lamp near the heat dissipation substrate. This installation method has the following disadvantages: [0005] 1 Due to the cumbersome processing procedures, the mass production efficiency is low; ...

Claims

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Application Information

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IPC IPC(8): F21V17/10F21V19/00F21Y101/02F21Y115/10
Inventor 马少峰
Owner 马少峰
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