Method of assembling an ultrasonic transducer and the transducer obtained thereby
A transducer, ultrasonic technology, applied in the use of vibration fluid, manufacture/assembly of piezoelectric/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0041] figure 1 is a schematic diagram of a transducer according to the invention. The transducer 1 comprises a plurality of ceramic wafers 2 , for example piezoelectric ceramic wafers, which alternate with a plurality of electrodes 3 . At the interfaces of the ceramics 2 and the electrodes 3 are arranged thin connection layers 6 which are typically between 10 and 50 microns and preferably between 10 and 30 microns in thickness. The electrodes are cut from rolled metal sheets, for example from sheets of annealed silver or copper beryllium alloy, or even from sheets of titanium alloy. The thickness of each intermediate electrode is greater than 20 microns, and preferably between 50 microns and 1 mm.
[0042] The thickness of these substantially rectangular or square profile wafer form ceramics is typically between 1 mm and 5 mm to be able to operate within the stress and frequency ranges required to produce a fuel injector. The width "1" of the stack 9 comprising alternating...
PUM
Property | Measurement | Unit |
---|---|---|
Size | aaaaa | aaaaa |
Average temperature | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com