Burn-in method based on SIP module

A technology of aging and aging time, which is applied in the direction of measuring devices, instruments, measuring electronics, etc., to achieve the effect of easy realization, good aging effect and strong practicability

Active Publication Date: 2014-05-28
BEIJING MXTRONICS CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the SIP module is different from the single-chip integrated circuit. The SIP module needs to be considered and designed for each single chip of the entire module. The burn-in method and steps of the single chip are not completely suitable for the SIP module.

Method used

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  • Burn-in method based on SIP module
  • Burn-in method based on SIP module

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Experimental program
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Embodiment Construction

[0039] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0040] The present invention is based on a SIP module containing a processor module CPU, a program running space module, an FPGA, and a nonvolatile memory FLASH. Module configuration, during the burn-in process, the operation, access, and control of each module are executed inside the SIP module under test. The connection circuit between the SIP module and the burn-in system is simple. Modules have less impact.

[0041] Such as figure 1 Shown is a schematic diagram of the structure of the aging of the SIP module of the present invention in the aging box, the aging of the SIP module of the present invention is realized in the aging box, a number of aging boards are arranged in the aging box, and a number of sockets are arranged on the aging board , the SIP module is placed on the socket of the aging board, and one of the sockets corresponds to ...

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Abstract

The invention relates to a burn-in method based on an SIP module. The burn-in method is achieved in a burn-in box. The burn-in method is based on the SIP module comprising a processor module CPU, a program running space module, an FPGA module and a nonvolatile memory FLASH. According to the designed burn-in method, a burn-in program is written in the SIP module in a programmed mode, a power-on program automatically runs, the FPGA module is automatically configured, and running, access and control of all the modules are executed inside the tested SIP module in the burn-in process. The connecting circuit between the SIP module and the burn-in box is simple. According to the method, burn-in of the SIP module is achieved by fully using the functions of the SIP module, the complexity of the connecting circuit between the SIP module and the burn-in box is greatly lowered, the influences of an external circuit on the SIP module are reduced in the burn-in process, and meanwhile fault analysis can be conveniently conducted.

Description

technical field [0001] The present invention relates to a burn-in method based on SIP (System In a Package, system-level packaging) modules, especially a method that includes processor implementation, FLASH or other non-volatile memory implementation and FPGA (Field Programmable Gate Array) ) The burn-in method of the SIP module can be used as the realization of the burn-in process in the SIP module reliability test, and belongs to the field of integrated circuit technology. Background technique [0002] System-on-chip integration is an important direction of microsystem integration technology. With the growing demand for miniaturization, programmability and high reliability of weapon systems, space systems and aircraft, the burden reduction of electronic control systems has become the main means of system optimization. FPGA, memory, AD / DA and other functional modules are integrated according to specific requirements to achieve dynamic configurability and high integration o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/00
Inventor 祝天瑞兰利东赵光忠李志远王枭鸿
Owner BEIJING MXTRONICS CORP
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