Manufacturing method of inductor unit

Abstract

The invention brings forward a manufacturing method of an inductor unit. The method comprises the following steps: providing a substrate, and attaching multiple signal emitters and multiple signal detectors on the substrate for respectively define multiple inductor areas; then electrically connecting the signal emitters and the signal detectors with the substrate through a wiring bonding mode; carrying out first molding formation manufacturing to enable multiple packaging structures to be molded on the substrate, each packaging structure being corresponding to an inductor area to wrap a signal emitter and a signal detector; providing a packaging top board provided with multiple openings with geometric figures; carrying out second molding formation manufacturing, arranging the packaging top board on the multiple packaging structures, and forming an isolation layer disposed between the packaging board and the substrate through an injection modeling step, the isolation layer wrapping the peripheries of the multiple packaging structures; and finally, performing crystal cutting processing so as to segment each inductor area.

Description

Technical field [0001] The present invention relates to a method for manufacturing an inductor unit, in particular to a method for manufacturing an inductor unit formed by two-time molding and using the production of a package top plate. Background technique [0002] With the development of electronic products, many types of input devices are currently available for operations in electronic systems, such as buttons or keys, mice, trackballs, touch screens, and so on. Recently, the application of touch screens has become more and more common. The touch screen may include a touch panel, which may be a transparent panel with a touch-sensitive surface, so that the work surface covers the viewable area of ​​the display screen. The touch screen allows the user to touch the display screen with a finger or a stylus to make selections and move the cursor, and to achieve corresponding actions according to touch events. The IR proximity sensor is widely used in handheld communication devic...

AI Technical Summary

Problems solved by technology

However, the above-mentioned structure has the following disadvantages: the manufacture and structure of the metal frame are complex; and the packaging structure needs to be glued, and the above-mentioned metal frame is fixed by gluing, but the coating of the glue is not easy to control, too much glue will Causes the problem of overflowing glue; too little glue, the metal frame is not well fixed, easy to fall off or shift, which will lead to poor signal isolation

[0005] Furthermore, under the trend of reducing the size of components, the metal frame and packaging structure must have a very high precision, so that they can be assembled with each other to form a sensor unit with high isolation effect, so the difficulty of manufacturing is greatly increased, and the product yield rate Can't effectively improve

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