75results about How to "Reduce crosstalk interference" patented technology

Embodiments herein are primarily described in the context of a system, a method, and a non-transitory computer readable medium for producing a sound with enhanced spatial detectability and reduced crosstalk interference. The audio processing system receives an input audio signal, and performs an audio processing on the input audio signal to generate an output audio signal. In one aspect of the disclosed embodiments, the audio processing system divides the input audio signal into different frequency bands, and enhances a spatial component of the input audio signal with respect to a nonspatial component of the input audio signal for each frequency band.

In a transmission system which makes use of frequency translated signals, said system having a plurality of lines, a method for reducing crosstalk induced on a signal on a first line of said plurality of lines by a signal on a second line of said plurality of lines, comprising estimating a complex coupling factor for the crosstalk, which when multiplied by the signal on the second line estimates the induced crosstalk; and subtracting the estimated induced crosstalk from the signal on the first line. The invention comprises an approximation method for multiplying the complex coupling factor by the signal on the second line that operates on the signal on the second line through pre-rotation, scaling and multiplication by a complex number according to the coupling factor, said complex number being chosen from a bank of predetermined complex numbers so as to obtain the best approximation possible.

The present invention comprises a system and method for reduction of the influence of crosstalk, increase in and control over quality of service, increase in stability and reduction of power use in a system having multiple transmission lines. A novel crosstalk measurement method is introduced. Knowing the crosstalk, various algorithms may be employed, for example to reduce or eliminate its effects in order to guarantee a bit error rate equal to or less than the maximum allowed for each line. Similar methods are provided to minimize power consumption, or maximize related measures of line performance. Systems, devices, methods and techniques are provided that allow communication system to adapt transmission power margin, power spectral densities, and the like dynamically to changing subscriber's application needs in MIMO systems.

An electrical receptacle connector includes an insulated housing, upper-row terminals, lower-row terminals, and a grounding sheet. The insulated housing includes a base portion and a tongue portion. The tongue portion is extended from one side of the base portion and has an upper surface and a lower surface. The upper-row terminals are disposed at the base portion and the tongue portion and include a ground terminal located at the upper surface The lower-row terminals are disposed at the base portion and the tongue portion and include a ground terminal located at the lower surface. The grounding sheet is disposed at the insulated housing and located between the ground terminal of the upper-row terminals and the ground terminal of the lower-row terminals. The grounding sheet includes one or more protruded portion in contact with the ground terminal of the upper-row terminals or the ground terminal of the lower-row terminals.

A balanced transmission shielded cable comprising an inner conductive shield (3) and an outer conductive shield (5) surrounding the inner conductive shield (3). In an annular region (A) defined between both shields (3, 5), unshielded twisted pairs (4) for signal transmission and shielded drain lines (6) are alternately disposed in annular array. The shielded drain lines (6) contact both shields (3, 5) and are led outside and grounded. Both shields (3, 5) surrounding the twisted pairs (4) and the shielded drain lines (6, 6) keep a substantially uniform distance with respect to conductive lines constituting the twisted pairs (4).

A female electrical connector includes an insulative housing, a rack mounted in the insulative housing and 8 pcs of gold pins arranged in the rack for signal transmission. The 1^st, 3^rd and 5^th pins each have the respective top end extending obliquely backwardly from the front side of the rack and then curved and closely attached to the rear side of the rack so that the transmission direction of the 1^st, 3^rd and 5^th pins is reversed to that of the 2^nd, 4^th, 6^th, 7^th and 8^th pins, enabling the female electrical connector for signal transmission in the fully bandwidth range of 1˜500 MHz.

The invention brings forward a manufacturing method of an inductor unit. The method comprises the following steps: providing a substrate, and attaching multiple signal emitters and multiple signal detectors on the substrate for respectively define multiple inductor areas; then electrically connecting the signal emitters and the signal detectors with the substrate through a wiring bonding mode; carrying out first molding formation manufacturing to enable multiple packaging structures to be molded on the substrate, each packaging structure being corresponding to an inductor area to wrap a signal emitter and a signal detector; providing a packaging top board provided with multiple openings with geometric figures; carrying out second molding formation manufacturing, arranging the packaging top board on the multiple packaging structures, and forming an isolation layer disposed between the packaging board and the substrate through an injection modeling step, the isolation layer wrapping the peripheries of the multiple packaging structures; and finally, performing crystal cutting processing so as to segment each inductor area.

The invention discloses a homeotropic liquid crystal display and a pixel structure thereof. The homeotropic liquid crystal display comprises an upper substrate and a lower substrate; two pixels are defined by two data lines of the lower substrate and every two scanning lines; each pixel comprises a pixel electrode and a transistor; a slot is kept between the pixel electrodes of the two pixels; and a bias electrode is arranged below the slot; wherein the bias electrode has a voltage valve VE; the pixel electrode has a voltage valve VP, and when the voltage value is in a positive frame, VP is larger than VE, and when the voltage value is in a negative frame, VP is less than VE.

The invention discloses a method for reducing the crosstalk of a mobile terminal and the mobile terminal, which relate to the communication field and solve the problem of unclear stereo sound caused by the crosstalk. The mobile terminal is provided with an audio output module, one end of the common resistance of the audio output module is respectively connected to the N channel modules, and the other end of the common resistance is connected to the power amplifier, and the method for reducing the crosstalk of the mobile terminal includes: obtaining the impedance value of the common resistance and the impedance value of the load of N channel modules; according to the impedance value of the common resistance and the impedance value of the load of N channel modules, calculate the crosstalk adjustment parameter of the power amplifier; control the power amplifier to the common resistance according to the crosstalk adjustment parameter Outputting a compensation signal, the compensation signal is used to reduce the voltage of the common connection point between the common resistance and the N channel modules, so as to reduce the crosstalk between the N channel modules. In this way, the method for reducing crosstalk in a mobile terminal provided by the embodiment of the present invention can reduce crosstalk interference and obtain clear stereo sound.

The invention provides a network connector socket which comprises an insulated body, a plurality of first terminals and a plurality of second terminals. Each first terminal comprises a first fixed section fixed in the insulated body, and the first fixed sections are arrayed side by side along a first plane in a coplanar way. Each second terminal comprises a second fixed section fixed in the insulated body, and the second fixed sections extend along a second plane which is separated from the first plane and are arrayed side by side in the coplanar way. One of the first fixed sections bends and extends to intersect with at least one second fixed section, the transverse width of the first fixed section of one of the first terminals is larger than that of the other parts, and the transverse width of the second fixed section of one of the second terminals is greater than that of the other parts. Through the structure provided by the invention, a capacitance compensation function is realized, and the crosstalk disturbance among the terminals is reduced.

The invention provides a single-fiber bidirectional erbium-doped optical fiber amplifier with multiple input/output ends, which is applied to the single-fiber bidirectional optical fiber communication system, can directly amplify the uplink optical signal and the downlink optical signal, provide a plurality of input/output ends, and is particularly suitable for bidirectional transformation of the optical access network and optical fiber CATV network; and the cost is close to that of traditional erbium-doped optical fiber amplifier.

A universal series bus (USB) connector including a base, a first terminal set, and a second terminal set and a method of manufacturing the universal series bus connector are provided. The first terminal set includes a pair of first differential signal terminals and a pair of second differential signal terminals, and terminals of the pair of first differential signal terminals are adjacent to each other and terminals of the pair of second differential signal terminals are adjacent to each other. Two of terminals of the second terminal set are located at two opposite sides of the pair of first differential signal terminals, and another two of the terminals of the second terminal set are located at two opposite sides of the pair of second differential signal terminals.

The invention provides an image sensor device, a forming method and a semiconductor device. The image sensor device includes a semiconductor substrate having a first type of conductivity, a semiconductor layer having the first type of conductivity formed on the semiconductor substrate, and pixels formed in the semiconductor layer. The semiconductor layer includes a first deep well having the first type of conductivity and substantially underlying the plurality of pixels, and a second deep well having a second type of conductivity different from the first type of conductivity and substantially underlying the first deep well. The device and forming method provided by the invention has high efficiency and cost benefit, and can reduce crosstalk interference.

The invention discloses an electrical connector, which is used for electrically conducting a first component and a second component. The electrical connector comprises: an insulating block; a plurality of terminals which are arranged in an upper row and a lower row, each terminal having a horizontal section fixed in the insulating block, a first conductive portion extending forward from the horizontal section for electrically conducting the first component, and a second conductive portion extending rearward from the horizontal section, wherein the second conductive portion has a bent portion connected to the horizontal section; and a shield plate fixed to the insulating block and positioned between two rows of terminals. The rear end of the shield plate is provided with an abutment part for abutting on the second component. The abutment part extends backward out of the insulating body and does not exceed the bent part.

The invention relates to a connector which comprises an insulating core body, a plurality of signal terminal pairs fixed on the insulating core body, and a plurality of grounding terminals fixed on the insulating core body. The insulating core body is provided with a fixed end and a plug end which are opposite. Each signal terminal of the signal terminal pairs extends to the plug end from the fixed end. Each grounding terminal extends to the plug end from the fixed end, wherein in the plug end, a plurality of grounding terminals are arranged at the first row of the first height, at least one pair of the plurality of signal terminal pairs is arranged at the second row of the second height, and the rest signal terminal pairs of the plurality of signal terminal pairs are arranged at the third row of the third height.

An electric coupler capable of lowering high-frequency crosstalk noise can allow at least two butt joint pieces to be inserted in. The electric coupler capable of lowering the high-frequency crosstalk noise comprises a first connector, a first signal terminal, a second connector, a second signal terminal and a grounding terminal. One of the two butt joint pieces can be inserted into the first connector, and the first signal terminal is used for being electrically connected with the butt joint piece which is inserted into the first connector. The other butt joint piece can be inserted into the second connector, and the second signal terminal is used for being electrically connected with the butt joint piece which is inserted into the second connector. The grounding terminal is electrically connected to the first connector and the second connector and located between the first signal terminal and the second signal terminal. The grounding terminal and the first signal terminal form a signal backflow space, the grounding terminal and the second signal terminal also form a signal backflow space, and the signal backflow spaces serve as signal backflow paths of the first signal terminal and the second signal terminal.

A wafer level chip scale package and a manufacturing method thereof are disclosed. The wafer level chip scale package comprises a plurality of redistribution layer (RDL) circuits connected to a silicon wafer through openings of a first polymer layer, with the openings penetrating the first polymer layer to connect the redistribution layer circuits to metal pads on a top surface of the silicon wafer; a plurality of underbump metal (UBM) layers each of which is in contact with one of the plurality of RDL circuits through openings in a second polymer layer over the first polymer layer; a plurality of solder bumps which lie on each UBM layer; a metal plating layer which lies under the first polymer layer and does not contact any of the plurality of RDL circuits; and at least one separator which lies between at least two of the plurality of RDL traces. The separator is a metal fencing between the two neighboring RDL circuits or an air gap between the two neighboring RDL circuits.