Multi-layer flexible circuit board and process for producing the same

Abstract

The present invention provides a multi-layer flexible circuit board, comprising at least an electric circuit disposed on a vertical interval layer, wherein at least two sides of the electric circuit are covered by neighboring interval layer and another vertical interval composed layer of electric insulating material. The disclosure provides a non-pressing way to stack the multi-layer flexible circuit board, thereby preventing disjunctions between layers, reducing the product thickness, increasing yield rate, and reducing crosstalk between electric circuits.

Description

technical field [0001] The invention relates to a multi-layer flexible printed circuit board and its manufacturing method, in particular to a multi-layer flexible printed circuit board stacked mainly by covering at least two sides of the electrical circuit unit with an electrical insulating layer. Flexible printed circuit board and its manufacturing method. Background technique [0002] Known flexible printed circuit boards are all obtained by processing and manufacturing a semi-finished product of a precursor substrate. The precursor substrate needs to be coated with a metal conductive layer to facilitate subsequent processing and manufacturing. Generally speaking, the material of these substrates is The surface is inherently difficult to be attached to the metal. For this reason, the known treatment methods include metal spraying method, sputtering method, CVD, evaporation method, and dry plating method, etc. However, these methods will cause the precursor substrate The t...

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Problems solved by technology

[0002] Known flexible printed circuit boards are all obtained by processing and manufacturing a semi-finished product of a precursor substrate. The precursor substrate needs to be coated with a metal conductive layer to facilitate subsequent processing and manufacturing. Generally speaking, the material of these substrates is The surface is inherently difficult to be attached to the metal. For this reason, the known treatment methods include metal spraying method, sputtering method, CVD, evaporation method, and dry plating method, etc. However, these methods will cause the precursor substrate The thickness of the semi-finished product is thick or the plating is difficult or the plating time is too long

Excessive thickness will not be conducive to the current trend of product miniaturization

[0003] Moreover, the problem of thicker thickness is not conducive to the manufacture of multi-layer flexible printed circuit boards; the problem of difficult plating and long plating time will lead to limited production capacity and excessive cost.

In addition, multi-layer flexible printed circuit boards are mostly produced by lamination. This known method often has lamination defects, and then bubbles are generated due to structural gaps, resulting in poor yields. good

[0004] In addition, there are many multi-layer electrical circuits, and the problem of crosstalk between electrical circuits is serious, which is also a problem to be solved.

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