Laser cutting machine capable of generating period cutting depth

Abstract

The invention discloses a laser cutting machine capable of generating period cutting depth. The laser cutting machine comprises a laser head and a rotary mechanism, wherein a 1 / 2 wave plate, a reflecting lens, a focusing lens and a movable carrier table are sequentially arranged along the laser transmission direction of the laser head, an LED (light emitting diode) chip is arranged on the movable carrier table, and the 1 / 2 wave plate is fixedly connected with the power output end of the rotary mechanism, and is driven by the rotary mechanism to rotate in the radial direction of the 1 / 2 wave plate. The cutting machine has the advantage that the polarizing direction of the laser beam is changed under the rotation function of the 1 / 2 wave plate, the cutting depth of the LED chip is periodically changed, and the ablation area of the side wall of the LED chip is reduced, so the structure is simple, the cost is low, and the ablation degree on the side wall of a sapphire substrate is low.

Description

technical field [0001] The invention relates to a laser cutting machine, in particular to a laser cutting machine capable of producing periodic cutting depths. Background technique [0002] The process of mechanical splitting after laser scribing is a common process in the LED chip cutting process, especially applied to blue LEDs based on sapphire. At present, blue LED chips based on sapphire are doped with phosphor and Capable of producing white light, this kind of LED will be the mainstream in the lighting field in the future. At the same time, how to further increase brightness and reduce costs has been a subject of the industry's efforts. After adopting laser scribing, although the grain separation technology of mechanical splitting has high production rate and low cost, the side wall of the sapphire substrate is ablated during laser scribing, such as Figure 4 As shown, the laser emitted by the laser head 1 sequentially passes through the reflector 3 and the focusing mi...

AI Technical Summary

Problems solved by technology

One is to use an ultrafast laser to form a cutting line inside the substrate to reduce the degree of ablation of the sidewall, but due to the high design cost, the equipment cost is high

Another way is to etch with high-temperature sulfuric acid / phosphoric acid after laser scribing to remove the ablation. Although the cost of this method is low, the steps are complicated, and the problem of etching is that it is not easy to clean when the cutting depth is too deep. Clean, but lack of depth and poor splitting yield

Therefore, in the prior art, there is a lack of a laser cutting machine with simple structure, low cost, and low degree of ablation to the side wall of the sapphire substrate.

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