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Reactive sputtering plasma control system and method

A plasma and control system technology, applied in the field of plasma control systems, can solve the problems of high-speed, precise, stable control, high-performance and high-quality compound films, etc., and achieve sputtering deposition rate and feedback The effect of accurate signal and stable control

Inactive Publication Date: 2014-06-18
GUANGZHOU MECHANICAL & ELECTRICAL TECH RES INST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At that time, when there are high requirements for large-area substrates and uniformity of the film layer, it is difficult to achieve high-speed, precise and stable control only by using a single input control of the gas sensor, which will make it difficult to prepare high-performance and high-quality compound films. brings difficulties

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  • Reactive sputtering plasma control system and method
  • Reactive sputtering plasma control system and method

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Embodiment Construction

[0024] It is easy to understand that, according to the technical solution of the present invention, those skilled in the art can propose multiple structural modes and production methods of the present invention without changing the essence and spirit of the present invention. Therefore, the following specific embodiments and drawings are only specific descriptions of the technical solution of the present invention, and should not be regarded as the entirety of the present invention or as a limitation or limitation of the technical solution of the present invention.

[0025] The present invention will be further described in detail below in conjunction with the embodiments and accompanying drawings.

[0026] figure 1 It is a schematic diagram of the representation method of the reactive sputtering plasma control system, the control system includes: a controller, a power supply, a gas flow piezoelectric valve, a coating chamber and multi-channel sensor feedback; the controller c...

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Abstract

The invention discloses a reactive sputtering plasma control system and method. The control system comprises a controller, a power supply, gas flow piezoelectric valves, a film plating chamber and a multi-channel sensing feedback, wherein the controller controls the output current and voltage of the sputtering power supply and a working gas flow piezoelectric valve and a reacting gas flow piezoelectric valve through control signals; the multi-channel sensing feedback comprises a plasma spectrum feedback circuit, a gas partial pressure feedback circuit and a target current and voltage feedback circuit. According to the system and method disclosed by the invention, the rapid feedback and real-time control of a sputtering process are realized through monitoring a plasma reaction sputtering spectrum and controlling the precise content of working gas and reacting gas, the target current and voltage and the like, so that the stability of the sputtering deposition rate is realized, and the stability of the composition of a sputtered film is guaranteed. The system and the method not only are applicable to relatively small substrates and single sputtering materials, but also have a relatively good effect on large-area substrates and co-doped sputtering materials.

Description

technical field [0001] The invention relates to a vacuum reactive sputtering coating technology, in particular to a plasma control system and method for multi-channel feedback control in the reactive magnetron sputtering process. Background technique [0002] As we all know, vacuum coating technology has been widely used in many industries, and it is called the core key technology in flat panel display, solar photovoltaic, new electronic information, energy-saving glass and other industries. The challenge of the future market for the vacuum coating process technology lies in the mass production of high-quality precision optical films and electrical films. At present, with the advancement of magnetron sputtering technology and equipment and technological breakthroughs in sputtering process monitoring technology, it is gradually being applied to the preparation of high-quality optical films. [0003] The reactive sputtering method is a technology used to generate compound fil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34C23C14/54
Inventor 王小辉卫红曹一鸣刘志宇陈霞莫忠
Owner GUANGZHOU MECHANICAL & ELECTRICAL TECH RES INST
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