Semiconductor equipment and its heater

Abstract

The invention discloses a heater used for a semiconductor device. The heater includes an upper cover plate, a lower cover plate, a connection assembly, a heating wire and a back-blowing air-intake component; an air supplying through hole is formed in the upper cover plate; the connection assembly is connected with the lower surface of the lower cover plate; the connection assembly is used for positioning the upper cover plate, the lower cover plate and the connection assembly itself in a vacuum reaction chamber of the semiconductor devices; a cavity is defined between the upper surface of the lower cover plate and the lower surface of the upper cover plate; an electrical lead of the heating wire is in sealing with the connection assembly; and the back-blowing air-intake component passes through the connection assembly and the lower cover plate sequentially and is connected with the air supplying through hole in a sealing manner. According to the heater used in the semiconductor device of the invention, the heating wire is positioned in a vacuum environment, such that the heating wire no longer directly exchanges heat with atmosphere, and therefore, heat loss can be reduced, and heating efficiency can be improved. In addition, the invention also discloses a semiconductor device.

Description

technical field [0001] The invention relates to the field of semiconductor equipment manufacturing, in particular to a semiconductor equipment and a heater of the semiconductor equipment. Background technique [0002] In semiconductor equipment, many processes need to be heated. There are two main types of heaters, one is radiant heating, and the other is resistance wire heating. The radiant heating method has the characteristics of fast heating rate and high efficiency. , but often the uniformity of heating is not good; while the resistance wire heater can solve the uniformity problem very well. Evenly and quickly delivered to the heating target. [0003] The parts of the high-temperature heater in the prior art are sealed and connected by welding, but due to the limitation of the structure of the heater, the welds between the parts are often long. When in use, there is no gas release in the reaction chamber, and the requirements for the welding process are relatively hig...

AI Technical Summary

Problems solved by technology

[0002] In semiconductor equipment, many processes need to be heated. There are two main types of heaters, one is radiant heating, and the other is resistance wire heating. The radiant heating method has the characteristics of fast heating rate and high efficiency. , but often the uniformity of heating is not good; while the resistance wire heater can solve the uniformity problem very well. Evenly and quickly delivered to the heating target

[0003] The parts of the high-temperature heater in the prior art are sealed and connected by welding, but due to the limitation of the structure of the heater, the welds between the parts are often long. There is no degassing in the reaction chamber during use, and the requirements for welding technology are high and the cost is high

[0004] Moreover, the heating wire of the high-temperature heater in the prior art is usually heated on the atmosphere side. Since the heating wire is in direct contact with the atmosphere, part of the heating power will be taken away by conduction and convection of the air, resulting in low heater efficiency.

In addition, since the heater is integrally welded and formed, when some components, especially the heating wire or sensor are damaged, the heater will completely lose its use value, which will increase the cost and cause waste

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