Glue coating crystal solidifying method and system thereof
A technology of solid crystal and glue covering, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of non-coincident position of crystal grain and glue point, difficulty in controlling the height of chip encapsulation, poor consistency of glue point size, etc., to achieve easy Finished product heat dissipation, reduce design layout and calculation difficulty, and ensure the effect of consistency
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[0049] The present invention provides a glue-coated crystal solidification method and system thereof. In order to make the objectives, technical solutions, and effects of the present invention clearer and clearer, the present invention will be further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.
[0050] See figure 1 , figure 1 It is a flow chart of the method for coating and crystal fixing of the invention.
[0051] Such as figure 1 As shown, the glue-coating method for crystal fixing includes:
[0052] In step S100, the die on the wafer tray is picked up by the die attach arm.
[0053] Wherein, step S100 specifically includes:
[0054] Step S110: align the center of the pick-up device at the end of the die attach arm and place it above the surface of the die on the wafer tray;
[0055] Step S120, l...
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