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Solvent-free composite method and composite device for high-temperature cooking composite film and bag

A high-temperature cooking and composite film technology, which is applied in the field of composite film and bags, can solve the problems of large occupied space and space, high composite equipment design, and long drying section, so as to reduce overall production costs, save procurement costs, and improve production efficiency effect

Active Publication Date: 2016-02-10
CHENGDU XINGHENGTAI PRINTING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] When organic solvents enter the atmosphere, they will cause certain pollution to the environment; organic solvents are difficult to volatilize completely, and their residues are harmful to the human body; during production, the first substrate is continuously moving towards the composite direction, in order to minimize the content of organic solvents , so the number of drying devices designed is large, and the drying section is long, so that the composite equipment is designed to be relatively high, large, and long, and it occupies a large space and space; the dry composite 4-stage heating drying oven, each section is dry The box requires a 30-kilowatt heating tube and a 20-kilowatt exhaust fan to ensure that the organic solvent in the coated glue is volatilized and dried to the maximum, so energy consumption is large; the high-temperature cooking composite film is used for dry compounding, and the amount of glue on the bag reaches 4 ~4.5g / ㎡, or even higher, the material cost is relatively high, while the maximum production rate of dry compounding is only 180m / min, and the production efficiency is relatively low

Method used

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  • Solvent-free composite method and composite device for high-temperature cooking composite film and bag

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Embodiment Construction

[0027] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0028] For simplicity, some technical features known to those skilled in the art are omitted from the following description.

[0029] like figure 1 Shown in the flowchart of an embodiment of the solvent-free composite method of high-temperature cooking composite film and bag of the present invention, it includes

[0030] Put the first film in a room at 23±2°C and humidity 60±5% for 8 hours of pretreatment, and install the first film on the first unwinding device and pass it through the guide roller according to the composite direction of the film;

[0031] Put the first film into a room at 23±2°C and humidity 60±5% for 8 hours of pretreatment. The purpose is to allow the -CO-NH- on the surface of the first film to react with H20 in ...

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Abstract

The invention discloses a solvent-free complex method of high temperature cooking complex films and bags and a complex device thereof. The complex method comprises the following steps of preprocessing a first film, placing the first film on a first unreeling device and passing through a guiding roller according to a complex trend of the film, and preheating an adhesive, a gumming device and a complex heat drum; placing a second film on a second unreeling device and passing through the guiding roller according to the complex trend of the film, regulating glue inlet capacity of the gumming device, producing, and finally rolling, curing and cooling. The complex device comprises the first unreeling device, the gumming device, the second unreeling device, the complex heat drum, a rolling device and a pulling roller wherein are arranged on a rack and a glue adding barrel for adding the adhesive in the gumming device. The complex method and the complex device provided by the invention have the advantages that the environmental pollution is not generated, the energy consumption is low, the space occupation is small and the like, the method can utilize air humidity under a certain environment temperature, and mechanical properties of the complex films are effectively improved.

Description

technical field [0001] The invention relates to the technical field of composite films and bags, in particular to a solvent-free composite method for high-temperature cooking composite films and bags and a composite device thereof. Background technique [0002] In the flexible packaging industry, high-temperature cooking composite films and bags are all dry-laminated. The dry compounding method in the prior art is as follows: unwinding→coating diluted adhesivedrying organic solventhot pressing compounding→cooling→winding. The reason for using an organic solvent to dilute the adhesive is that the adhesive has relatively high viscosity. In order to evenly coat the adhesive on the first substrate, an organic solvent capable of dissolving the adhesive must be used. The newly produced composite film has low initial adhesion and low peel strength. When a large amount of organic solvent volatilizes, the two layers of film substrates will be separated and delaminated, and the "co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/12B32B37/06
Inventor 蒋昌勇蒋芙蓉蒋小东
Owner CHENGDU XINGHENGTAI PRINTING
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