Chemical mechanical polishing fluid for computer hard disk

A chemical machinery and polishing liquid technology, applied in the computer field, can solve the problems of reducing the surface roughness of hard disks, not involving removal rate and surface roughness, etc., to improve surface quality and processing efficiency, enhance dispersibility, and reduce requirements. Effect

Active Publication Date: 2015-12-02
SHANGHAI XINANNA ELECTRONICS TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The hard disk polishing solution disclosed in CN201210046523 mainly relates to an alkaline memory hard disk polishing composition, which is used for rough polishing of computer hard disk substrates, and has added complexing agents and corrosion aids to reduce the roughness of the hard disk surface; CN200610013979 discloses Nano-SiO2 Polishing for Disk Substrates of Memory Hard Disks 2 The alkaline polishing fluid with hydrosol as abrasive has strong chelating effect, and uses small particle size abrasives to solve the traditional problems of roughness, waviness and surface defects, but none of them involve the removal rate and The problem of surface roughness

Method used

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  • Chemical mechanical polishing fluid for computer hard disk

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] 1. Experimental equipment and reagents

[0025] 1) Instrument: CMPtester (CETRCP-4)

[0026] 2) The composition of computer hard disk chemical mechanical polishing fluid is as follows:

[0027] Abrasive particles: SiO with a radius of 10nm 2 5wt%;

[0028] Oxidant: hydrogen peroxide 2wt%;

[0029] Sodium polyacrylate 1wt%;

[0030] 0.1M hydrochloric acid was used to adjust the pH of the polishing solution to 3.0, and the solvent was deionized water.

[0031] 2. Detection method - hard disk 3.5-inch disc polishing test method

[0032] Condition: Pressure (DownForce): 5psi

[0033] Polishing pad speed (PadSpeed): 150rpm

[0034] Polishing head speed (CarrierSpeed): 150rpm

[0035] Temperature: 25°C

[0036] Polishing liquid flow rate (FeedRate): 150ml / min

[0037] Using the computer hard disk chemical mechanical polishing liquid prepared in this example as the polishing liquid, the hard disk is polished by the CP-4 polishing machine of the American CETR company,...

Embodiment 2

[0041] 1. Experimental equipment and reagents

[0042] 1) Instrument: CMPtester (CETRCP-4)

[0043] 2) The composition of computer hard disk chemical mechanical polishing fluid is as follows:

[0044] Abrasive particles: SiO with a radius of 50nm 2 1wt%;

[0045] Oxidant: Potassium ferricyanide 10wt%;

[0046] Sodium polyoxyethylene sulfate 0.5wt%;

[0047] 2M hydrochloric acid was used to adjust the pH of the polishing solution to 3.0, and the solvent was deionized water.

[0048] 2. Detection method - hard disk 3.5-inch disc polishing test method

[0049] Condition: Pressure (DownForce): 5psi

[0050] Polishing pad speed (PadSpeed): 150rpm

[0051] Polishing head speed (CarrierSpeed): 150rpm

[0052] Temperature: 25°C

[0053] Polishing liquid flow rate (FeedRate): 150ml / min

[0054]Using the computer hard disk chemical mechanical polishing liquid prepared in this example as the polishing liquid, the hard disk is polished by the CP-4 polishing machine of the Americ...

Embodiment 3

[0058] 1. Experimental equipment and reagents

[0059] 1) Instrument: CMPtester (CETRCP-4)

[0060] 2) The composition of computer hard disk chemical mechanical polishing fluid is as follows:

[0061] Abrasive particles: SiO with a radius of 80nm 2 10wt%;

[0062] Oxidizing agent: ammonium persulfate 2wt%;

[0063] Sodium polyoxyethylene ether phosphate 1.5wt%;

[0064] 0.1M hydrochloric acid was used to adjust the pH value of the polishing solution to 1.0, and the solvent was deionized water.

[0065] 2. Detection method - hard disk 3.5-inch disc polishing test method

[0066] Condition: Pressure (DownForce): 5psi

[0067] Polishing pad speed (PadSpeed): 150rpm

[0068] Polishing head speed (CarrierSpeed): 150rpm

[0069] Temperature: 25°C

[0070] Polishing liquid flow rate (FeedRate): 150ml / min

[0071] Using the computer hard disk chemical mechanical polishing liquid prepared in this example as the polishing liquid, the hard disk is polished by the CP-4 polishing...

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Abstract

The invention relates to the field of computers, and particularly relates to a chemico-mechanical polishing solution of a computer disc, which can be effectively applied to a computer NiP hard disc. The chemico-mechanical polishing solution of the computer disc is a water solution containing an oxidizing agent, grinding particles, a salt additive and a pH regulating agent, wherein a general formula of the salt additive is X-R-Y, wherein X is a positive ion, Y is a negative ion and R is a linear-chain alkyl or a derivative thereof. By adopting the chemico-mechanical polishing solution provided by the invention, the polishing rate of the hard disc reaches 90 nm / min, the surface roughness is lower, and the surface quality and the processing efficiency of the hard disc are effectively increased.

Description

technical field [0001] The invention relates to the field of computers, in particular to a chemical mechanical polishing liquid for computer hard disks. Background technique [0002] In the hard disk drive industry, the demand for increased data capacity has been increasing in the last decade, and the requirements for storage and reading technology of hard disks are getting higher and higher. From a head-to-disk interface perspective, shortening the distance from the temporary read-write head to the disk media has been the primary driver for achieving higher data densities on hard disk drives. In order to shorten the gap between the magnetic head and the magnetic disk as much as possible, it is necessary to control the surface roughness of the magnetic disk to a sufficiently low level. When rotating at high speed, the heat generated by the friction between the disk and the air cannot be ignored. The hard disk with a smoother surface will naturally have an advantage in this ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09G1/02
Inventor 宋晗王良咏刘卫丽宋志棠
Owner SHANGHAI XINANNA ELECTRONICS TECH
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