Chip type wireless audio receiving and transmitting integrated system

Abstract

The invention relates to the technical field of micro-electronic chip packaging, and discloses a chip type wireless audio receiving and transmitting integrated system. A packaging shell and a substrate plate are matched to form standard appearance packaging, chips for collecting processing and transmitting audio signals are placed in the packaging shell, a paster is installed on the substrate plate, and the chips are electrically connected based on the bonding technology. The chips for collecting processing and transmitting the audio signals are integrated to the same PCB based on the SIP technology and are packaged to the packaging outer shell to form a micro integrated system with the audio signal collecting function, the audio signal processing function and the audio signal transmitting function. Compare with a traditional detectaphone, a micro type interceptor has the advantages of being small in size, low in power consumption, easy to hide and the like.

Description

technical field [0001] The invention relates to the technical field of microelectronic chip packaging, in particular to a chip-type wireless audio transceiver integrated system. Background technique [0002] With the development of semiconductor technology, in order to improve the performance of semiconductor devices while minimizing packaging, high-integration packaging technologies such as wafer-level packaging, systematic packaging, and chip-level packaging have been proposed. The device has system capabilities. [0003] However, SIP (System in a package) technology overcomes the technical difficulty of SOC (System on a chip) chip packaging technology that it is difficult to integrate analog, radio frequency and digital functions in a small feature size, and has broad application prospects. The so-called systematic integration is to load one or more high-performance modules composed of bare chips and possible passive components in a package, including stacking multiple c...

AI Technical Summary

Problems solved by technology

This requires a large amount of external layout and wiring to complete this connection, which will occupy a large amount of space on the circuit board and increase the difficulty of routing. The volume will also increase accordingly, so that the bug is large in size, power consumption is large, and it is easy to be found

Due to the large size of the bug, it is difficult for criminal investigators to find the installation location when installing the bug, and after installation, it is easy to be found, which interrupts the monitoring, and even threatens the personal safety of nearby criminal investigators who are responsible for monitoring because the bug is discovered

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