Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A method for reducing sizing amount of melamine-modified urea-formaldehyde resin wood adhesive

A wood adhesive, melamine technology, applied in the direction of adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problems of difficult large-scale industrial application, large investment, and rising adhesive costs. , to achieve the effect of simple method, guaranteed physical and mechanical properties, and cost saving

Inactive Publication Date: 2016-10-05
DEHUA TB NEW DECORATION MATERIAL CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the addition of melamine has brought about an increase in the cost of the adhesive, and controlling the manufacturing cost of melamine-modified urea-formaldehyde resin is an important issue
Reducing the amount of sizing is the most direct way to reduce costs. In recent years, some special sizing equipment and methods to improve the performance of adhesives have been developed, but these aspects have the disadvantages of large investment and difficulty in large-scale industrial application.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] The melamine-modified urea-formaldehyde resin was prepared by alkali-acid-alkali process, the final molar ratio of formaldehyde to urea was 1.1, the content of melamine was 6% (by weight), and the viscosity was 68 mPa. s, add 0.3 times the water of the glue solution at the completion of the glue making stage, stir at high speed for 0.5 hours, adjust the glue, apply the glue to the surface of the shavings with a suitable moisture content, the glue amount is 9%, pave and enter the press Hot pressed into particleboard. 11mm thick and 750 kg / m density 3 The properties are: elastic modulus 2000MPa, static bending strength 16 MPa, internal bonding strength 0.50 MPa, formaldehyde emission 7.1mg / 100g. Compared with the performance of the particleboard prepared by undiluted glue, the amount of glue applied is reduced by 16%, the elastic modulus is increased by 20%, the static bending strength is 30%, and the internal bond strength is increased by 8%.

Embodiment 2

[0014] The melamine-modified urea-formaldehyde resin was prepared by alkali-acid-alkali process, the final molar ratio of formaldehyde to urea was 1.2, the content of melamine was 7% (by weight), and the viscosity was 76 mPa. s, add 0.8 times the water of the glue solution at the completion of the glue making stage, stir at high speed for 0.5 hours, adjust the glue, apply the glue to the surface of the shavings with a suitable moisture content, the glue amount is 10%, pave and enter the press Hot pressed into particleboard. 16mm thick and 750 kg / m density 3 The properties are: elastic modulus 1800MPa, static bending strength 14 MPa, internal bonding strength 0.40 MPa, formaldehyde emission 6.3 mg / 100g. Compared with the performance of particleboard prepared with undiluted glue, the amount of glue applied is reduced by 18%, the elastic modulus is increased by 5%, the static bending strength is 10%, and the internal bond strength is increased by 5%.

Embodiment 3

[0016] The melamine-modified urea-formaldehyde resin was prepared by alkali-acid-alkali process, the final molar ratio of formaldehyde and urea was 1.05, the content of melamine was 8% (by weight), and the viscosity was 85 mPa. s, add 0.5 times the water of the glue solution at the completion of the glue making stage, stir at high speed for 0.5 hours, adjust the glue, apply the glue to the surface of the shavings with a suitable moisture content, the glue amount is 9%, pave and enter the press Hot pressed into particleboard. 11mm thick and 750 kg / m density 3 The properties are: elastic modulus 1900 MPa, static bending strength 15 MPa, internal bond strength 0.43 MPa, formaldehyde emission 5.6 mg / 100g. Compared with the performance of the particleboard prepared by undiluted glue, the amount of glue applied was reduced by 14%, the elastic modulus was increased by 18%, the static bending strength was 15%, and the internal bonding strength was increased by 10%.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
strengthaaaaaaaaaa
release amountaaaaaaaaaa
strengthaaaaaaaaaa
Login to View More

Abstract

The invention belongs to the field of wood adhesives, and particularly relates to a method for reducing the sizing amount of melamine-modified urea-formaldehyde resin wood adhesives, which includes the steps of making glue, adjusting glue, sizing glue and hot pressing, and is characterized in that the method is diluted Reduce the sizing amount of the melamine modified urea-formaldehyde resin wood adhesive; the dilution method is to add water to dilute, which is used for gluing of medium and high density fiberboards and particleboards. The melamine-modified urea-formaldehyde resin adhesive of the present invention has a melamine content of more than 5% (by weight) and good water solubility. The dilution process can be completed in the late stage of glue production or in the stage of glue mixing. The amount of water added is 0.1~2 times the weight of the adhesive, and then stirred at high speed. The invention has the advantages of being able to reduce the amount of sizing by 9-18%, the amount of formaldehyde emission above E1, the method is simple, the use is convenient, the cost is saved, and the physical and mechanical properties of the board are guaranteed at the same time.

Description

technical field [0001] The invention belongs to the field of wood adhesives, and in particular relates to a method for reducing the sizing amount of melamine-modified urea-formaldehyde resin wood adhesives, especially a dilution method for gluing medium and high-density fiberboards and particleboards. Background technique [0002] The free formaldehyde released from wood-based panels seriously pollutes the environment and endangers people's physical and mental health, which has become a hot issue of general concern in the society. For this reason, the Chinese government promulgated the mandatory standard GB 18580-2001 "Limits of formaldehyde release from wood-based panels and their products for interior decoration materials" on January 1, 2002. The traditional wood-based panel manufacturing process and urea-formaldehyde resin adhesive are difficult to meet the requirements of low formaldehyde emission. Faced with this situation, the addition of melamine-modified urea-formal...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J161/30C09J11/00
Inventor 崔举庆韩书广冯小朴贾翀朱军韩勇黄河浪卢晓宁
Owner DEHUA TB NEW DECORATION MATERIAL CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com