An electroplating diversion device and system
A diversion device, electroplating plate technology, applied in the direction of the plating tank, etc., can solve the problems of high production and use costs, cumbersome assembly and maintenance, and many device components, and achieve the effects of easy assembly, improved electroplating quality, and uniform thickness of the coating
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Embodiment 1
[0038] see figure 1 , the present embodiment provides an electroplating guide device, which is made of insulating material, and includes a support plate 1 and a partition 2, the support plates 1 are arranged at intervals along the moving direction of the electroplating plate, and the partition Both ends of the plate 2 are respectively fixedly connected to the support plate 1, and the partition plates 2 are evenly arranged in several layers along the height direction of the support plate 1, and gaps are formed between two adjacent layers of the partition plates 2.
[0039]The technical solution above is the core technical solution of the present invention. In this solution, since the electroplating metal liquid is divided into several layers by the partition in the vertical direction, it can effectively block the electric force line, making it difficult for the metal ions below the lower end of the electroplating plate to move directly to The lower end of the electroplating pla...
Embodiment 2
[0048] This embodiment provides an electroplating flow guiding device, which is an improvement on the basis of Embodiment 1. In this embodiment, the top of the uppermost partition 2 is provided with a A deflector 14, the side of the deflector 14 close to the electroplating plate is lower than the side away from the electroplating plate, and the deflector 14 is fixedly arranged on the support plate 1 . The electroplating metal liquid flows obliquely downward along the upper surface of the guide plate to the plate surface of the electroplating plate. Since the two sides of the electroplating plate are equipped with electroplating flow guiding devices with the same specification, the electroplating metal liquid received by both sides of the electroplating plate The impact forces in the horizontal direction are equal in size and opposite in direction, which can cancel each other out, and in the vertical direction, the electroplating metal liquid can guide and stretch the thin plate...
Embodiment 3
[0050] see Figure 4 , this embodiment provides an electroplating guide device, which is an improvement on the basis of Embodiment 1 or Embodiment 2. In this embodiment, the upper end of the side of the support plate 1 away from the electroplating plate A titanium blue bracket 12 placed horizontally is provided, and a plurality of through holes 13 for placing titanium basket bags are arranged on the titanium blue bracket 12 . This arrangement mainly takes into account the integrated design of the relevant components, which can reduce the workload during assembly and is also convenient for placing the titanium basket bag. Of course, the titanium basket bracket 12 can also place other metals.
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