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An electroplating diversion device and system

A diversion device, electroplating plate technology, applied in the direction of the plating tank, etc., can solve the problems of high production and use costs, cumbersome assembly and maintenance, and many device components, and achieve the effects of easy assembly, improved electroplating quality, and uniform thickness of the coating

Active Publication Date: 2017-03-15
KUNSHAN DONGWEI MACHINERY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is to overcome the existing devices for improving the uniformity of electroplated plate coating with many components, complex structure, and the need to set up related lifting drive devices to adapt to the processing of electroplated plates of different sizes, and its assembly and maintenance. The technical defects of relatively cumbersome, high production and use costs provide an electroplating guide device and system with a simple structure, low production and maintenance costs, and can improve the uniformity of the coating

Method used

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  • An electroplating diversion device and system
  • An electroplating diversion device and system
  • An electroplating diversion device and system

Examples

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Effect test

Embodiment 1

[0038] see figure 1 , the present embodiment provides an electroplating guide device, which is made of insulating material, and includes a support plate 1 and a partition 2, the support plates 1 are arranged at intervals along the moving direction of the electroplating plate, and the partition Both ends of the plate 2 are respectively fixedly connected to the support plate 1, and the partition plates 2 are evenly arranged in several layers along the height direction of the support plate 1, and gaps are formed between two adjacent layers of the partition plates 2.

[0039]The technical solution above is the core technical solution of the present invention. In this solution, since the electroplating metal liquid is divided into several layers by the partition in the vertical direction, it can effectively block the electric force line, making it difficult for the metal ions below the lower end of the electroplating plate to move directly to The lower end of the electroplating pla...

Embodiment 2

[0048] This embodiment provides an electroplating flow guiding device, which is an improvement on the basis of Embodiment 1. In this embodiment, the top of the uppermost partition 2 is provided with a A deflector 14, the side of the deflector 14 close to the electroplating plate is lower than the side away from the electroplating plate, and the deflector 14 is fixedly arranged on the support plate 1 . The electroplating metal liquid flows obliquely downward along the upper surface of the guide plate to the plate surface of the electroplating plate. Since the two sides of the electroplating plate are equipped with electroplating flow guiding devices with the same specification, the electroplating metal liquid received by both sides of the electroplating plate The impact forces in the horizontal direction are equal in size and opposite in direction, which can cancel each other out, and in the vertical direction, the electroplating metal liquid can guide and stretch the thin plate...

Embodiment 3

[0050] see Figure 4 , this embodiment provides an electroplating guide device, which is an improvement on the basis of Embodiment 1 or Embodiment 2. In this embodiment, the upper end of the side of the support plate 1 away from the electroplating plate A titanium blue bracket 12 placed horizontally is provided, and a plurality of through holes 13 for placing titanium basket bags are arranged on the titanium blue bracket 12 . This arrangement mainly takes into account the integrated design of the relevant components, which can reduce the workload during assembly and is also convenient for placing the titanium basket bag. Of course, the titanium basket bracket 12 can also place other metals.

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Abstract

The invention discloses an electroplating guide device and system. The electroplating guide device comprises supporting plates and partition plates, wherein the supporting plates are arranged at intervals along the moving direction of an electroplating plate; the two ends of each of the partition plates are fixedly connected on the supporting plates, respectively; the partition plates are uniformly arranged into a plurality of layers along the height direction of the supporting plates; and a gap is formed between the adjacent two layers of the partition plates. The electroplating guide device disclosed by the invention enables an electroplating metal liquid to be divided into a plurality of layers in a vertical direction, metal ions underneath the lower end of the electroplating plate are very difficult to directly move to the lower end of the electroplating plate for being reduced into metal atoms, and therefore, thickness of a clad layer at the lower end of the electroplating plate is almost equal to that of the clad layer on the other parts of the electroplating plate, and the plate surface of the whole electroplating plate is provided with more uniform clad layer metal; and moreover, the electroplating guide device disclosed by the invention is simple in structure, convenient to manufacture and install and produce, and lower in maintenance cost; and moreover, a baffle plate, a lifting device, and the like do not need to be arranged, so that thickness of the clad layer can be guaranteed to be uniform.

Description

technical field [0001] The invention relates to an electroplating diversion device and system for improving the uniformity of the plating layer of an electroplating plate, and belongs to the technical field of electroplating equipment. Background technique [0002] When performing electroplating operations on electroplated plates, it is often necessary to use the same electroplating bath (titanium basket size is the same) to electroplate electroplated plates of different sizes. When electroplating electroplated plates with smaller sizes, the electroplated plates cannot reach the electroplating bath As a result, more ions will accumulate under the electroplating plate, resulting in a thicker coating under the electroplating plate, resulting in uneven thickness of the coating on the entire plate surface, which not only wastes electroplated metal, but also seriously affects the quality of the plated parts. [0003] In order to make the surface of the plated parts have a relativ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/02
Inventor 江泽军
Owner KUNSHAN DONGWEI MACHINERY CO LTD