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Hermetic and microwell sealing devices for immersion lithography machines

A sealing device and air-sealing technology, which is applied to the exposure device of photoengraving process, opto-mechanical equipment, micro-lithography exposure equipment, etc., to achieve the effect of preventing leakage and high scanning speed

Active Publication Date: 2015-11-25
ZHEJIANG CHEER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem of gap flow field sealing and liquid renewal rate in partial immersion lithography technology, the object of the present invention is to provide a kind of air sealing and micropore sealing device for immersion lithography machine, using a square at the edge of the flow field The microporous structure and air-tight structure prevent liquid leakage in the gap flow field, and use large-flow liquid injection and recovery structures to solve the problem of liquid renewal rate

Method used

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  • Hermetic and microwell sealing devices for immersion lithography machines
  • Hermetic and microwell sealing devices for immersion lithography machines
  • Hermetic and microwell sealing devices for immersion lithography machines

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Embodiment Construction

[0034] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0035] Such as figure 1 , figure 2 As shown, the present invention is provided with an airtight and micropore sealing device 2 between the projection lens group 1 and the silicon wafer 3 in the immersion lithography machine; the airtight and micropore sealing device 2 includes an immersion unit base 2A, The upper end cover 2B of the immersion unit, the lower end cover 2C of the immersion unit and the airtight end cover 2D of the immersion unit; The air-tight end cover of the unit is in contact with 2D, and is connected tightly by screws.

[0036] The air-tight and microporous sealing device 2 is installed between the projection lens group 1 and the silicon wafer 3. The air-tight and micro-porous sealing device 2 has a central cone hole. 10 is restricted directly below the projection objective lens group 1, and the light emitted from the projection o...

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PUM

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Abstract

The invention discloses an airtight and microporous seal device for an immersion lithography machine. The airtight and microporous seal device is arranged between the projecting lens group and a silicon wafer of the immersion lithography machine and comprises an immersion unit base body, an immersion unit upper end cover, an immersion unit lower end cover and an immersion unit airtight seal end cover, wherein the upper surface of the immersion unit base body is in contact with the immersion unit upper end cover; the lower surface of the immersion unit base body is in contact with and firmly connected with the immersion unit lower end cover and the immersion unit airtight seal end cover in sequence. The airtight microporous seal device can perform the functions of sealing a gap flow field in the immersion lithography system as well as injecting and recovering a liquid; an airtight seal structure and a microporous structure are adopted to prevent liquid leakage; negative pressure is applied to micropores to recover the liquid and constrain the gap flow field; the airtight seal structure is used for sealing the gap flow field and meanwhile ensuring the edge stability of the gap flow field; the stability and updating of immersion liquid in the gap flow field are realized through large-flow liquid injection and recovery.

Description

technical field [0001] The invention relates to a flow field sealing and liquid injection recovery device, in particular to an air sealing and micropore sealing device for an immersion photolithography machine. Background technique [0002] The lithography machine is one of the core equipment for manufacturing VLSI. The modern lithography machine is mainly based on optical lithography. It uses the optical system to accurately project and expose the pattern on the mask to the silicon coated with photoresist. Chip. It includes a laser light source, an optical system, a projection mask composed of chip patterns, an alignment system and a silicon wafer coated with photosensitive photoresist. [0003] Immersion Lithography (Immersion Lithography) equipment fills a liquid with a high refractive index between the last projection objective lens and the silicon wafer, which improves the numerical aperture (NA) of the projection objective lens compared to the dry lithography machine ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70341
Inventor 傅新徐宁陈文昱
Owner ZHEJIANG CHEER TECH CO LTD
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