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Silicon wafer accurate positioning and conveying device and positioning method

A technology for precise positioning and transmission devices, which is applied in the directions of transportation and packaging, exposure devices for photolithography, conveyor objects, etc. It can solve the problems that the positioning accuracy and repeatability of the mechanical arm cannot meet the needs of high-precision transmission, and achieve convenient control. The effect of high alignment accuracy and simple method

Active Publication Date: 2014-08-06
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is that the positioning accuracy and repeatability of the mechanical arm itself cannot meet the high-precision transmission requirements. In order to overcome the above shortcomings, a silicon wafer precise positioning transmission device and positioning method are provided.

Method used

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  • Silicon wafer accurate positioning and conveying device and positioning method
  • Silicon wafer accurate positioning and conveying device and positioning method
  • Silicon wafer accurate positioning and conveying device and positioning method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Such as figure 2 As shown, the precise positioning transfer device for silicon wafers includes a base 11, a mechanical arm 12 rotatably mounted on the base, an actuator 13 arranged at the end of the mechanical arm 12, and a gap between the mechanical arm 12 and the actuator 13. The elastic connection device A and the positioning mechanism 16 , the transfer device and the workbench 15 perform transfer of the silicon wafer 14 .

[0039] Such as image 3 As shown, the elastic connection device A includes an upper piece 21 connected to the mechanical arm 12, a lower piece 22 fixedly connected to the actuator, a connecting mechanism for elastically connecting the upper piece 21 and the lower piece 22, and a detection mechanism for precise positioning. .

[0040] The detection mechanism includes a laser light source 241, a hole detection mark 242, a sensor 243, an L-shaped first connector 244 interlocked with each other and a 7-shaped second connector 245. The upper end of t...

Embodiment 2

[0050] Such as Figure 5 As shown, the setting position and method of the detection mechanism in Embodiment 1 are changed. The detection mechanism in this technical solution includes two half-frame brackets 246 with gaps opposite to each other, two groups of sensors 243 and laser light source 241 and fixed on the lower plate 22. The detection plate 247 at the front end, the same group of sensors 243 and the laser light source 241 are arranged on a support 246 and are set up and down oppositely. The detection plate 247 is provided with two hole-shaped detection marks 242. When detecting and positioning, one hole-shaped detection mark 242 242 corresponds to a group of sensors 243 and a laser light source 241 .

Embodiment 3

[0052] Such as Figure 6 As shown, using the silicon wafer transmission precise positioning device of embodiment 1 or embodiment 2, the method for silicon wafer transmission precise positioning comprises the following steps:

[0053] 1) When the transfer device A and the workbench 15 of the pre-alignment unit carry out the transfer of the silicon wafer 14, the standard coordinate information of the actuator 13 is collected and recorded through the detection mechanism;

[0054] 2) When the transfer device A and the workbench 15 of the workpiece unit carry out the transfer of the silicon wafer 14, the actuator 13 is roughly positioned by the positioning mechanism 16;

[0055] 3) The elastic connection mechanism deforms under pressure, and the detection mechanism obtains real-time coordinate information;

[0056] 4) Convert the standard coordinate information into the coordinate information in the coordinate system of the workpiece unit, and compare it with the real-time coordin...

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Abstract

The invention belongs to photoetching equipment, and particularly relates to a silicon wafer accurate positioning and conveying device and a positioning method. The conveying device comprises a base, a mechanical arm, an actuator and a positioning mechanism and hands over silicon wafers to a working table, the conveying device further comprises an elastic connecting device between the mechanical arm and the actuator, the elastic connecting device comprises an upper piece connected with the mechanical arm, a lower piece fixedly connected with the actuator, a connecting mechanism elastically connected with the upper piece and the lower piece and a detection mechanism used for accurate positioning. The positioning method includes the steps that the conveying device is positioned coarsely through the positioning mechanism, the elastic connecting mechanism and the detection mechanism carry out fine adjustment control to accurately position the conveying device, and finally the silicon wafers are handed over. The device is simple and compact in structure, reliable to use, convenient to control and high in alignment accuracy. The method is easy and convenient to carry out, and can achieve full automatic operation of accurate positioning and conveying the silicon wafers conveniently.

Description

technical field [0001] The invention belongs to photolithography equipment, and in particular relates to a silicon chip precise positioning transmission device and a positioning method. Background technique [0002] A lithographic apparatus is a device that exposes a mask pattern onto a silicon wafer. In many semiconductor equipment such as lithography machines, materials such as substrates or silicon wafers need to be transported quickly, accurately and reliably. The above-mentioned handling system is the transmission system, which is an important part of the lithography equipment. With the continuous development of technology in the integrated circuit manufacturing industry, the accuracy of chip marking continues to increase, and the size of silicon wafers becomes larger. The requirements for the transmission system are reflected in the improvement of the accuracy of the transmission of silicon wafers to the workpiece table. As a result, mechanical Or optical pre-alignme...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L21/68G03F7/20G03F9/00
CPCG03F7/70258G03F9/7088H01L21/67259H01L21/67742H01L21/68
Inventor 方舟
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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