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Heat transfer strengthening microchannel

A technology to enhance heat transfer and micro-channels, applied in electrical components, electrical solid devices, circuits, etc., can solve the problem of low electronic heat dissipation, and achieve the effect of large aspect ratio and excellent mechanical properties

Inactive Publication Date: 2014-08-13
11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the above-mentioned analysis, the present invention aims to provide a microchannel for enhancing heat transfer, in order to solve the problem of low electron heat dissipation in the prior art

Method used

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0024] The present invention proposes a structure and method for enhancing heat transfer using carbon nanotubes as ciliated ribs inside a microchannel. In order to better understand the present invention, the present invention will be described in detail below with only a few specific examples.

[0025] The enhanced heat transfer microchannel of the embodiment of the present invention is an enhanced heat transfer structure in which carbon nanotubes (bundles) ar...

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Abstract

The invention discloses a heat transfer strengthening microchannel. According to the heat transfer strengthening microchannel, one or more cilium ribs are arranged on any cross section inside the microchannel, each cilium rib passes through or does not pass through the center line of the microchannel, and the angles formed between the cilium ribs are random. Due to the arrangement of the cilium ribs inside the microchannel for heat transfer strengthening, the multiple advantages of the microchannel heat exchange and cilium rib heat transfer strengthening technology and the multiple advantages of a carbon nano tube material are effectively combined, and the advantages of the carbon nano tube material that heat conductivity is ultrahigh, the length-diameter ratio is large, the mechanical property is excellent, the diameter is superfine, and flow resistance is hardly generated are fully utilized. The heat transfer strengthening microchannel is especially suitable for the microchannel layer laminar flow heat exchange technology.

Description

technical field [0001] The invention relates to the technical field of heat transfer enhancement and heat exchangers, in particular to a microchannel for enhancing heat transfer. Background technique [0002] In recent years, with the continuous progress of information industry, material industry, aerospace technology, energy engineering, life science and technology and modern nanometer manufacturing technology, highly integrated microelectronic devices, high power lasers, micromachining technology and microelectromechanical systems , The integration level, packaging density and operating frequency of the chip are continuously and rapidly increasing, and the ratio of power to volume is increasing day by day, which brings about a rapid increase in the heat flux density of the chip, which makes the heat dissipation of the chip face a severe test. The current problem of electronic heat dissipation has become a bottleneck restricting the development of the microelectronics indus...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/367
Inventor 刘刚赵鸿吕坤鹏刘洋王超刘磊唐晓军
Owner 11TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP