curable composition
A composition and compound technology, applied in the direction of electric solid-state devices, semiconductor/solid-state device components, instruments, etc., can solve the problems of the heat resistance of silicone resin, etc.
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Embodiment 1
[0175] A curable composition capable of being cured by hydrosilylation was prepared by mixing the compounds represented by the formulas G and H with the organopolysiloxane (A) prepared in Synthesis Example 1 (mixing amount: organopolysiloxane Oxane (A): 25 g, compound of formula G: 50 g, and compound of formula H: 18 g). Subsequently, a catalyst (platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane) was mixed with the composition to have a Pt(0) content of 2 ppm , uniformly mixing the mixture, and removing air bubbles using a defoamer, thereby obtaining a curable composition.
[0176] [Formula G]
[0177] (HMe 2 SiO 1 / 2 ) (PhSiO 3 / 2 ) 3.5
[0178] [Formula H]
[0179] (HMe 2 SiO 1 / 2 ) 2 (Ph 2 SiO 2 / 2 ) 1.2
Embodiment 2
[0181] A curable composition capable of curing by hydrosilylation was prepared by mixing the compounds represented by the formulas I and J with the organopolysiloxane (B) prepared in Synthesis Example 2 by a known method (mixing amount: organopolysiloxane Oxane (B): 25 g, compound of formula I: 50 g, and compound of formula J: 18 g). Subsequently, a catalyst (platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane) was mixed with the composition to have a Pt(0) content of 2 ppm , uniformly mixing the mixture, and removing air bubbles using a defoamer, thereby obtaining a curable composition.
[0182] [Formula I]
[0183] (ViMe 2 SiO 1 / 2 ) (PhSiO 3 / 2 ) 3.5
[0184] [Formula J]
[0185] (HMe 2 SiO 1 / 2 ) 3 (Ph 2 SiO 2 / 2 ) 1.2
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