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curable composition

A composition and compound technology, applied in the direction of electric solid-state devices, semiconductor/solid-state device components, instruments, etc., can solve the problems of the heat resistance of silicone resin, etc.

Active Publication Date: 2017-06-09
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, silicones have reduced heat resistance and are tacky on the cured surface

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0175] A curable composition capable of being cured by hydrosilylation was prepared by mixing the compounds represented by the formulas G and H with the organopolysiloxane (A) prepared in Synthesis Example 1 (mixing amount: organopolysiloxane Oxane (A): 25 g, compound of formula G: 50 g, and compound of formula H: 18 g). Subsequently, a catalyst (platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane) was mixed with the composition to have a Pt(0) content of 2 ppm , uniformly mixing the mixture, and removing air bubbles using a defoamer, thereby obtaining a curable composition.

[0176] [Formula G]

[0177] (HMe 2 SiO 1 / 2 ) (PhSiO 3 / 2 ) 3.5

[0178] [Formula H]

[0179] (HMe 2 SiO 1 / 2 ) 2 (Ph 2 SiO 2 / 2 ) 1.2

Embodiment 2

[0181] A curable composition capable of curing by hydrosilylation was prepared by mixing the compounds represented by the formulas I and J with the organopolysiloxane (B) prepared in Synthesis Example 2 by a known method (mixing amount: organopolysiloxane Oxane (B): 25 g, compound of formula I: 50 g, and compound of formula J: 18 g). Subsequently, a catalyst (platinum(0)-1,3-divinyl-1,1,3,3-tetramethyldisiloxane) was mixed with the composition to have a Pt(0) content of 2 ppm , uniformly mixing the mixture, and removing air bubbles using a defoamer, thereby obtaining a curable composition.

[0182] [Formula I]

[0183] (ViMe 2 SiO 1 / 2 ) (PhSiO 3 / 2 ) 3.5

[0184] [Formula J]

[0185] (HMe 2 SiO 1 / 2 ) 3 (Ph 2 SiO 2 / 2 ) 1.2

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Abstract

The present application relates to a curable composition and its use. The curable composition of the illustrative examples can exhibit excellent processability and handleability. The curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance, and adhesiveness after curing. In addition, the composition exhibits long-term stable reliability even under severe conditions, and prevents generation of turbidity, surface stickiness, and the like.

Description

technical field [0001] The present application relates to a curable composition and its use. Background technique [0002] Light emitting diodes (LEDs), especially blue or ultraviolet (UV) LEDs emitting at a wavelength of about 250 to 550 nm, are high-brightness products using GaN-based compound semiconductors such as GaN, GaAlN, InGaN, or InAlGaN. In addition, high-quality full-color images can be formed by combining red LEDs with green LEDs and blue LEDs. For example, there is known a technique of preparing a white LED by combining a blue or UV LED with a fluorescent substance. Such LEDs are currently widely used as backlights or general lighting for liquid crystal displays (LCDs). [0003] Epoxy resins, which have high adhesiveness and excellent mechanical durability, are currently widely used as LED encapsulants. However, this epoxy resin has low light transmittance in the blue or ultraviolet region, and low light resistance. Therefore, for example, Patent Documents ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/04G02F1/13C08K5/54C08G77/04
CPCC08L83/04H01L33/56H01L33/501C08G77/12H01L2924/0002C08G77/14C08G77/20C08G77/70C08L83/06C08G77/80C08K5/56C08L83/00H01L23/296Y10T428/31663H01L2924/00C08K5/54C08G77/04G02F1/13
Inventor 高敏鐏文明善郑宰昊崔范圭姜大昊金珉均赵炳奎
Owner LG CHEM LTD