Multi-chamber sprayer with temperature controller

A nozzle and free radical technology, applied in metal material coating process, coating, gaseous chemical plating, etc., can solve problems such as damage to wafers

Active Publication Date: 2014-08-20
NOVELLUS SYSTEMS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, plasma transitions can also damage the wafer, for example, by oxidizing the underlying silicon of the wafer or the ultra-low-k dielectric used in the process.

Method used

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  • Multi-chamber sprayer with temperature controller
  • Multi-chamber sprayer with temperature controller
  • Multi-chamber sprayer with temperature controller

Examples

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Embodiment Construction

[0060] Examples of various implementations are illustrated in the drawings and described further below. It should be understood that the discussions herein are not intended to limit the claims to the specific embodiments described. On the contrary, it is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the invention as defined by the appended claims. In the following description, numerous implementation specific details are set forth in order to provide a thorough understanding of the invention. The invention may be practiced without some or all of the specific details of these embodiments. In other instances, well known process operations have not been described in detail so as not to unnecessarily obscure the present invention.

[0061]Various embodiments of three-part panel assemblies for showerheads for use with remote plasma sources and other features usable with remote plasma sources are described herei...

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Abstract

The invention discloses a multi-chamber sprayer with temperature controller, providing a device which is used along with the free base source in order to supply the free base during the semiconductor processing operation. The vice comprises a pile of plates and parts which form the panel assembly. The panel assembly comprises free base diffusion, a precursor transmission plate and an heat insulation device which is inserted between the free radical diffusion plate. The panel assembly possesses free through holes forming patterns. The free radical through holes has central lines which are substantially perpendicular to the free radical. The heat insulation device can regulate the heat flow between the free diffusion plate and the precursor transmission plate.

Description

[0001] Related Application Cross Reference [0002] This application requires U.S. Provisional Application No. 61 / 765,432 filed February 15, 2013 under 35 U.S.C. § 119(e) and 61 / 770,251 filed February 27, 2013 , both titled "MULTI-PLENUM SHOWERHEAD WITH TEMPERATURE CONTROL", the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates generally to semiconductor processing, and more particularly to showerheads in semiconductor processing. Background technique [0004] Semiconductor processing tools often use radical sources to distribute radicalizing process gases ( radicalized process gas). Such a radical source may include a faceplate that faces the wafer during processing, and gas distribution holes may be distributed across the faceplate to aid in the delivery of radicalizing gases from inside the radical source to the wafer. [0005] In some semiconductor fabrication processes, such as plasma enhanced chemic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/455
Inventor 帕特里克·G·布莱琳巴德里·N·瓦拉达拉简詹妮弗·L·彼得拉利亚巴特·J·范施拉芬迪克卡尔·F·利泽曼迪阿曼吉·斯利拉姆雷切尔·E·巴策尔
Owner NOVELLUS SYSTEMS
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